IP Library Granted Patent US 7,431,416
Granted Patent B2
US 7,431,416 · App. 11/216,762 · Granted Oct 7, 2008

Apparatus for jetting an alignment agent

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Quick Facts
Patent No.
US 7,431,416
App. No.
11/216,762
Granted
Oct 7, 2008
Kind
B2
Abstract

An apparatus for jetting an alignment agent includes a jetting head having a jetting hole, an alignment agent externally provided onto a substrate and a viscosity controlling part controlling a viscosity of the alignment agent stored in the jetting head to facilitate jetting of the alignment agent. The alignment agent is jetted to the substrate through the jetting hole. The apparatus improves the efficiency of jetting the alignment agent.

Claims (24)

1. An apparatus for jetting an alignment agent comprising:

a jetting head having a storage space for storing an alignment agent and a jetting hole through which the alignment agent is jetted onto a substrate; and

a viscosity controlling part controlling the viscosity of the alignment agent stored in the jetting head, wherein the viscosity controlling part comprises:

a heat pipe disposed in the jetting head, the heat pipe raising a temperature of the alignment agent stored in the jetting head; and

a heat supplying part disposed outside of the jetting head and supplying a heated gas or a heated solution to the heat pipe.

2. The apparatus of claim 1 , wherein the viscosity controlling part includes a temperature controller to control the temperature of the alignment agent.

3. The apparatus of claim 2 , wherein the viscosity controlling part heats the alignment agent, to lower the viscosity of the alignment agent.

4. The apparatus of claim 1 , wherein the alignment agent includes a polyimide-based material.

5. The apparatus of claim 2 , wherein the viscosity controlling part heats the alignment agent to raise a temperature of the alignment agent about or more than 50° C.

6. The apparatus of claim 5 , wherein the alignment agent that is heated has a viscosity of less than about 12 cp.

7. The apparatus of claim 1 , wherein the viscosity controlling part is disposed in the jetting head.

8. The apparatus of claim 1 , wherein the viscosity controlling part is disposed outside the jetting head.

9. The apparatus of claim 8 , wherein the viscosity controlling part is disposed under a bottom surface of the jetting head.

10. The apparatus of claim 1 , wherein the viscosity controlling part comprises:

a heat line disposed in the jetting head the heat pipe raising a temperature of the alignment agent stored in the jetting head; and

a heating part disposed outside of the jetting head and providing electrical power to the heat line for heating the heat line.

11. The apparatus of claim 1 , wherein the jetting part has a diameter ranged from about 50 μm to about 100 μm.

12. The apparatus of claim 1 , further comprising a piezo-electric part disposed in the storage space to extrude the alignment agent towards the jetting hole onto a substrate.

13. The apparatus of claim 12 , wherein the piezo-electric comprises a piezo-electric element and a vibrating plate.

14. An apparatus for jetting an alignment agent comprising:

a jetting head having a storage space for storing an alignment agent and a jetting hole through which the alignment agent is jetted onto a substrate; and

a viscosity controlling part controlling the viscosity of the alignment agent stored in the jetting head, wherein the viscosity controlling part includes a heat pipe disposed in the interior of jetting head, the heat pipe raising a temperature of the alignment agent stored in the jetting head and a heat supplying part disposed outside of the jetting head for heating the heat pipe and wherein the heat pipe has a closed structure within the interior of the jetting head such that a heating source received by the heat pipe from the heat supplying part for heating the heat pipe does not flow out of the heat pipe and into the interior of the jetting head.

15. The apparatus of claim 14 , wherein the heating source supplied from the supplying part to the heat pipe is a heated gas or a heated solution.

16. The apparatus of claim 14 , wherein the heating source supplied from the supplying part to the heat pipe is electrical power.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →