Energy monitoring or control of individual vias formed during laser micromachining
View Patent ↗A method and system increase the quality of results achieved by laser micromachining systems. Data relating to parameters controlling laser micromachining process are recorded during the micromachining process, identified by the feature associated with the parameters used to micromachine, and stored on the system. The stored data can be either retrieved during the micromachining process to enable real time control or retrieved after workpiece processing to conduct statistical process control.
1. A method of providing information regarding features micromachined into a workpiece using laser beam pulses controlled by a programmable controller, the features characterized by one or more specifications; the workpiece including one or more layers, each layer characterized by a material type and thickness; the laser beam pulses characterized by one or more preassigned parameters and optically associated with one or more detectors operatively connected to the programmable controller; the programmable controller operatively connected to a processor to process data including one or more of the preassigned laser beam pulse parameters, preassigned feature specifications, and preassigned workpiece characteristics; and the programmable controller operable to modify the laser beam pulse parameters based on information acquired from the one or more detectors and information acquired from the processor, comprising:
acquiring with a detector operatively associated with the laser beam pulses data corresponding to one of the laser beam pulse parameters used during micromachining of a particular feature of and at a particular location on the workpiece;
storing the laser beam pulse parameter data acquired during the micromachining of the particular feature;
associating the stored laser beam pulse parameter data acquired with a corresponding one of the preassigned laser beam pulse parameters, the preassigned feature specifications, and the preassigned workpiece characteristics of the particular feature micromachined; and
determining from the association whether there has occurred an operational change in the laser beam pulses that would impact a specified quality of the feature.
2. The method of claim 1 wherein the preassigned laser beam pulse parameters include one or more of type, size, pulse repetition rate, number of pulses, pulse shape, pulse width, pulse energy, peak pulse power, pulse energy tolerance, settling time, spot size, beam shape, or wavelength.
3. The method of claim 1 wherein the preassigned feature specifications include one or more of type, location, depth, shape, size, diameter, or allowable debris left after micromachining.
4. The method of claim 1 wherein the workpiece characteristics include one or more of the number and order of layers and the material or materials comprising each layer.
5. The method of claim 1 wherein the acquired parameter data are used for statistical quality control.
6. The method of claim 1 wherein the acquired parameter data are used to indicate the particular micromachined feature may have measurements that do not conform to a corresponding one of the preassigned feature specifications.
7. The method of claim 1 wherein the acquired parameter data associated with the particular micromachined feature are used to allow the programmable controller to direct additional laser beam pulses at the particular micromachined feature to perform additional micromachining.
8. The method of claim 1 wherein the laser beam pulse parameter data acquired with a corresponding one of the preassigned feature specifications, the preassigned workpiece characteristics, and the preassigned laser beam pulse parameters are used to modify the laser beam pulse parameters used to micromachine one of the features.
9. The method of claim 1 wherein the acquired parameter data are used by the programmable controller to modify the parameters used to micromachine subsequent workpieces.
10. The method of claim 1 wherein the workpiece being micromachined is a printed wiring board comprising one or more layers of dielectric or conductive material of various thicknesses.
11. The method of claim 1 wherein one of the features being micromachined is a substantially circular hole through one or more layers of the workpiece.