Nitride-based compound semiconductor light emitting device, structural unit thereof, and fabricating method thereof
View Patent ↗A nitride-based compound semiconductor light emitting device includes a first conductive substrate, a first ohmic electrode formed on the first conductive substrate, a bonding metal layer formed on the first ohmic electrode, a second ohmic electrode formed on the bonding metal layer, and a nitride-based compound semiconductor layer formed on the second ohmic electrode. The nitride-based compound semiconductor layer includes at least a P-type layer, a light emitting layer and an N-type layer, and has a concave groove portion or a concave-shaped portion.
1. A nitride-based compound semiconductor light emitting device, comprising:
a first conductive substrate;
a first ohmic electrode formed on the first conductive substrate;
a first bonding metal layer formed on the first ohmic electrode;
a second bonding metal layer bonded to the first bonding metal layer;
a second ohmic electrode formed on the second bonding metal layer; and
a nitride-based compound semiconductor layer formed on the second ohmic electrode,
wherein the nitride-based compound semiconductor layer comprises a P-type layer, a light emitting layer and an N-type layer; and
a concave groove portion or a concave-shaped portion formed in each of two opposing side surfaces of the nitride-based compound semiconductor light emitting device, the concave groove portion or the concave-shaped portion extending at least from the nitride-based compound semiconductor layer to the second bonding metal layer such that a surface area of said nitride-based compound semiconductor layer on a side of said second ohmic electrode is smaller than a surface area on a side opposite to said second ohmic electrode.
2. The nitride-based compound semiconductor light emitting device according to claim 1 , wherein the concave groove portion or concave-shaped portion extends from the nitride-based compound semiconductor layer to the first conductive substrate.
3. The nitride-based compound semiconductor light emitting device according to claim 1 , wherein said first conductive substrate is a semiconductor of at least one kind of material selected from the group consisting of Si, GaAs, GaP, Ge and InP.
4. The nitride-based compound semiconductor light emitting device according to claim 1 , further comprising a second substrate formed on the nitride-based compound semiconductor,
wherein the second substrate is an insulative substrate of sapphire, spinel or lithium niobate, or a conductive substrate of silicon carbide, silicon, zinc oxide or gallium arsenide.
5. The nitride-based compound semiconductor light emitting device according to claim 1 , wherein the first bonding metal layer and the second bonding metal layer are formed of the same material.
6. The nitride based compound semiconductor light emitting device according to claim 1 , wherein a side of the second bonding metal layer that bonds with the first bonding metal layer has a smaller surface area than a side of the nitride-based compound semiconductor layer opposite the second bonding metal layer.
7. The nitride-based compound semiconductor light emitting device according to claim 1 , wherein a side of the first bonding metal layer that bonds with the second bonding metal layer has a larger surface area than a side of the second bonding metal layer opposite the first bonding metal layer.
8. The nitride-based compound semiconductor light emitting device according to claim 1 , wherein the first bonding metal layer and the second bonding metal layer are formed of different materials from each other.
9. The nitride-based compound semiconductor light emitting device according to claim 2 , wherein a side of the first bonding metal layer that bonds with the second bonding metal layer has a smaller surface area than a side of the first conductive substrate opposite the first bonding metal layer.