Inverter unit, integrated circuit chip, and vehicle drive apparatus
View Patent ↗A miniaturizable, low-cost highly reliable inverter unit. A control circuit section for controlling operating timing of high breakdown voltage semiconductor elements included in an inverter circuit section and first and second drive and abnormality detection circuit sections for outputting drive signals for driving the high breakdown voltage semiconductor elements according to the operating timing and for feeding back an abnormality of the inverter circuit section to the control circuit section are formed on an SOI substrate as one integrated circuit chip. On the integrated circuit chip, circuit formation areas which differ in reference potential are separated from one another by dielectrics. A plurality of level shifters for transmitting signals exchanged between circuit formation areas separated by the dielectrics are formed.
1. An inverter unit for controlling an AC motor, the unit comprising:
an inverter circuit section including a plurality of high breakdown voltage semiconductor elements;
an integrated circuit chip including a first circuit section for controlling operating timing of the plurality of high breakdown voltage semiconductor elements and a second circuit section for outputting drive signals for driving the plurality of high breakdown voltage semiconductor elements according to the operating timing and for feeding back an abnormality of the inverter circuit section to the first circuit section formed on an SOI substrate;
a level shifter provided between circuit formation areas; and
a pulse generation circuit that converts a signal received from a circuit formation area to which a first power supply voltage is applied, into a one-shot pulse of a reference voltage that is different from a reference voltage of the signal, and inputs the one-shot pulse to the level shifter provided on a path that carries the signal from the circuit formation area to a circuit formation area to which a second power supply voltage higher than the first power voltage is applied, and
wherein the circuit formation areas which differ in reference potential are separated from one another by dielectrics, and
the dielectrics are separated from one another and surround the respective circuit formation areas.
2. The inverter unit according to claim 1 , wherein:
reference potential of each of the circuit formation areas are separated from one another is directly supplied by a wiring from a pad or a terminal for supplying the reference potential; and
wirings for supplying the reference potential are not shared by the circuit formation areas and are independent of one another.
3. The inverter unit according to claim 1 , wherein if the circuit formation areas separated from one another are formed on a flat surface, areas fixed at predetermined reference potential are formed between adjacent circuit formation areas.
4. The inverter unit according to claim 1 , wherein:
a diffusion layer to which reference potential is applied is located in an outer portion of each of the circuit formation areas separated from one another; and
an inner portion of each of the circuit formation areas is enclosed by the diffusion layer.
5. The inverter unit according to claim 1 , wherein the inverter circuit section and the integrated circuit chip are incorporated into one module.
6. An integrated circuit chip for driving an inverter circuit including a plurality of high breakdown voltage semiconductor elements, the chip comprising:
a first circuit section for controlling operating timing of the plurality of high breakdown voltage semiconductor elements;
a second circuit section for outputting drive signals for driving the plurality of high breakdown voltage semiconductor elements according to the operating timing and for feeding back an abnormality of the inverter circuit to the first circuit section;
a level shifter provided between circuit formation areas; and
a pulse generation circuit that converts a signal received from a circuit formation area to which a first power supply voltage is applied, into a one-shot pulse of a reference voltage that is different from a reference voltage of the signal, and inputs the one-shot pulse to the level shifter provided on a path that carries the signal from the circuit formation area to a circuit formation area to which a second power supply voltage higher than the first power voltage is applied, and
wherein the first circuit section and the second circuit section are formed on an SOI substrate,
wherein the circuit formation areas which differ in reference potential are separated from one another by dielectrics, and
wherein the dielectrics are separated from one another and surround the respective circuit formation areas.
7. The integrated circuit chip according to claim 6 , wherein:
reference potential of each of the circuit formation areas separated from one another is directly supplied by a wiring from a pad or a terminal for supplying the reference potential; and
wirings for supplying the reference potential are not shared by the circuit formation areas and are independent of one another.
8. The integrated circuit chip according to claim 6 , wherein if the circuit formation areas separated from one another are formed on a flat surface, areas fixed at predetermined reference potential are formed between adjacent circuit formation areas.
9. The integrated circuit chip according to claim 6 , wherein a diffusion layer to which reference potential is applied is located in an outer portion of each of the circuit formation areas separated from one another, and an inner portion of each of the circuit formation areas is enclosed by a diffusion layer.