Surface mount hermetic package for power semiconductor die
View Patent ↗A hermetically sealed AlN housing for power semiconductor die has a rectangular bottom surrounded by a peripheral wall. Spaced conductive plating sections on the top of the bottom section are connected by conductive vias to conductive plated sections on the bottom to enable surface mounting of the device. A ceramic lid is hermetically sealed over the top of the rectangular wall.
1. A ceramic housing for semiconductor die; said ceramic housing comprised of a ceramic material having a cup shape formed by a bottom planar section and a wall extending perpendicularly upward from the periphery of said bottom section; said bottom section having an interior surface within said wall and an exterior surface; first and second spaced and insulated conductive coatings on said interior surface and first and second spaced and insulated conductive coatings on said exterior surface and in registry with said first and second coatings on said interior surface respectively; a ceramic lid comprised of said ceramic material hermetically sealed to said wall; and a plurality of conductive vias extending perpendicularly through said bottom section and electrically connecting said first and second coatings on said interior surface to said first and second coatings on said bottom surface.
2. The structure of claim 1 , wherein said ceramic material is AlN.
3. The structure of claim 1 , wherein said bottom section is rectangular.
4. The structure of claim 2 , wherein said bottom section is rectangular.
5. The structure of claim 1 , wherein the free top of said wall has a Kovar ring secured thereto.
6. The structure of claim 4 , wherein the free top of said wall has a Kovar ring secured thereto.
7. The structure of claim 5 , wherein said ceramic lid is hermetically sealed to said Kovar ring.
8. The structure of claim 7 , wherein said ceramic material is AlN.
9. The structure of claim 8 , wherein said bottom section is rectangular.
10. The structure of claim 1 , which further includes a semiconductor die positioned within said walls of said housing and atop said bottom section; said semiconductor die having top and bottom power electrodes on its opposite surfaces; said bottom electrode being conductively secured to said first conductive coating on said interior surface of said bottom section; said top electrode being wire bonded to said second conductive coating on said interior surface of said bottom section.
11. The structure of claim 10 , wherein said semiconductor die is a power MOSFET.
12. The structure of claim 10 , wherein said semiconductor die is a power diode.
13. The structure of claim 10 , wherein said ceramic material is AlN.
14. The structure of claim 10 , wherein said bottom section is rectangular.
15. The structure of claim 10 , wherein the free top of said wall has a Kovar ring secured thereto.
16. The structure of claim 15 , wherein said ceramic lid is hermetically sealed to said Kovar ring.
17. The structure of claim 4 , wherein said bottom surface has a length of about 0.3 inch and a width of about 0.2 inch and a thickness of about 0.01 inch, and wherein said wall has a height of about 0.09 inch.
18. The structure of claim 6 , wherein said bottom surface has a length of about 0.3 inch and a width of about 0.2 inch and a thickness of about 0.01 inch, and wherein said wall has a height of about 0.09 inch.
19. The structure of claim 15 , wherein said bottom surface has a length of about 0.3 inch and a width of about 0.2 inch and a thickness of about 0.01 inch, and wherein said wall has a height of about 0.09 inch.
20. The structure of claim 17 , wherein said first conductive coating on said interior surface has the shape of a square which is about 0.05 inch less than said width of said bottom section on a side, and wherein said second conductive coating on said interior surface is a square about 0.06 inch on a side.
21. A ceramic housing for semiconductor die; said ceramic housing having a cup shape formed by a bottom planar section and a wall extending perpendicularly upward from the periphery of said bottom section; said bottom section having an interior surface within said wall and an exterior surface; first and second spaced and insulated conductive coatings on said interior surface and first and second spaced and insulated conductive coatings on said exterior surface and in registry with said first and second coatings on said interior surface respectively; and a plurality of conductive vias extending perpendicularly through said bottom section and electrically connecting said first and second coatings on said interior surface to said first and second coatings on said bottom surface; wherein the free top of said wall has a Kovar ring secured thereto.