Semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

1. A semiconductor composite apparatus, comprising:

a semiconductor thin film;

a substrate including a metal surface to which said semiconductor thin film is bonded; and

a region that contains an oxide of a metal that forms the metal surface, said region lying between said semiconductor thin film and said metal surface.

2. The semiconductor composite apparatus according to claim 1 , wherein the metal surface is a surface of a metal layer provided on said substrate.

3. The semiconductor composite apparatus according to claim 2 , wherein the metal layer is either a surface of a Pd layer or a surface of an Ni layer.

4. The semiconductor composite apparatus according to claim 1 , wherein the metal surface contains an element selected from the group consisting of Pd, Ni, Ge, Pt, Ti, Cr, and Au.

5. The semiconductor composite apparatus according to claim 1 wherein the semiconductor thin film includes at least one of a light-emitting element, a light-receiving element, a transistor, a circuit element, and an integrated circuit.

6. The semiconductor composite apparatus according to claim 5 , wherein the light-emitting element is a light emitting diode (LED).

7. The semiconductor composite apparatus according to claim 5 , wherein the light-emitting diode is a laser diode.

8. An LED head incorporating said semiconductor composite apparatus according to claim 1 .

9. An LED head incorporating said semiconductor composite apparatus according to claim 6 , comprising:

an optical device that adjusts light emitted from said semiconductor composite apparatus.

10. An image forming apparatus incorporating said LED head according to claim 8 , comprising:

a photoconductive body that is illuminated by said LED head.

11. A semiconductor composite apparatus in which a semiconductor thin film is bonded to a substrate, the apparatus comprising:

a first metal layer formed on a surface of the semiconductor thin film, the surface of the semiconductor thin film facing the substrate;

a metal surface formed on a surface of the substrate, the surface of the substrate facing the semiconductor thin film;

a region lying between said first metal layer and said metal surface, said region containing an oxide of a metal element that forms said first metal layer and an oxide of a metal element that forms said metal surface.

12. The semiconductor composite apparatus according to claim 11 , wherein said metal surface is either a Pd layer or an Ni layer.

13. The semiconductor composite apparatus according to claim 11 , wherein the metal surface contains an element selected from the group consisting of Pd, Ni, Ge, Pt, Ti, Cr, and Au.

14. The semiconductor composite apparatus according to claim 11 , wherein the metal surface is either a surface of a Pd layer or a surface of an Ni layer.

15. A semiconductor composite apparatus in which a semiconductor thin film is separated from a first substrate and is then bonded to a second substrate, the apparatus comprising:

a first metal layer formed on a surface of the semiconductor thin film, said first metal layer facing the second substrate;

a region that contains an oxide of a metal that forms the first metal layer, said region lying between said first metal layer and a surface of the second substrate.

16. The semiconductor according to claim 15 , wherein the first metal layer contains an element selected from the group consisting of Pd, Ni, Ge, Pt, Ti, Cr, and Au.

17. The semiconductor composite apparatus according to claim 15 , wherein the first metal layer is coated with either a Pd layer or an Ni layer.