Optoelectronic component with front to side surface electrical conductor
View Patent ↗Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
1. An optoelectronic component, comprising:
a silicon substrate having a first surface, a second surface opposite the first surface, and an exterior side edge surface;
an optoelectronic device flip-chip mounted on the first surface; and
an electrical conductor extending from the first surface and terminating at the side edge surface.
2. The optoelectronic component of claim 1 , wherein the side edge surface comprises a sloped section.
3. The optoelectronic component of claim 1 , wherein the side edge surface comprises a section perpendicular to the first surface.
4. The optoelectronic component of claim 1 , wherein the optoelectronic device is a light emitting diode.
5. The optoelectronic component of claim 1 , further comprising a heat sink to conduct heat away from the optoelectronic device.
6. The optoelectronic component of claim 1 , further comprising an encapsulant over the optoelectronic device.
7. The optoelectronic component of claim 6 , further comprising an optical element in the encapsulant.
8. The optoelectronic component of claim 1 , further comprising a driver in the substrate.
9. The optoelectronic component of claim 1 , further comprising a trench in the substrate, wherein the optoelectronic device is disposed in the trench.
10. The optoelectronic component of claim 1 , comprising a plurality of optoelectronic devices on the substrate.
11. An optoelectronic component, comprising:
a substrate having a first surface, a second surface opposite the first surface, and an exterior side edge surface;
an optoelectronic device flip-chip mounted to the first surface; and
an electrical conductor extending from the first surface and terminating at the side edge surface.
12. The optoelectronic component of claim 11 , wherein the side edge surface comprises a sloped section.
13. The optoelectronic component of claim 11 , wherein the side edge surface comprises a section perpendicular to the first surface.
14. The optoelectronic component of claim 11 , wherein the optoelectronic device is a light emitting diode.
15. The optoelectronic component of claim 11 , further comprising a driver in the substrate.
16. The optoelectronic component of claim 11 , further comprising a trench in the substrate, wherein the optoelectronic device is disposed in the trench.
17. A method of forming the optoelectronic component of claim 1 , comprising:
(a) providing a silicon substrate having a first surface, a second surface opposite the first surface, and an exterior side edge surface;
(b) forming an electrical conductor extending from the first surface and terminating at the side edge surface; and
(c) flip-chip mounting an optoelectronic device on the first surface.
18. A method of forming to optoelectronic component of claim 12 , comprising:
(a) providing a substrate having a first surface, a second surface opposite the first surface, and an exterior side edge surface;
(b) forming an electrical conductor extending from the first surface and terminating at the side edge surface; and
(c) flip chip mounting an optoelectronic device on the first surface.
19. The method of claim 17 , wherein (b) comprises forming a conductive layer over the side edge surface and separating the substrate into individual pieces along the conductive layer.
20. The method of claim 18 , wherein (b) comprises forming a conductive layer over the side edge surface and separating the substrate into individual pieces along the conductive layer.