Wafer-level optoelectronic device substrate
View Patent ↗Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
1. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises an optoelectronic device flip-chip mounted thereon.
2. The wafer-level optoelectronic device substrate of claim 1 , wherein the substrate is a silicon wafer.
3. The wafer-level optoelectronic device substrate of claim 1 , further comprising an encapsulant over each of the optoelectronic devices.
4. The wafer-level optoelectronic device substrate of claim 1 , wherein the optoelectronic device is a light emitting diode.
5. The wafer-level optoelectronic device substrate of claim 1 , further comprising a driver in each of the substrate portions.
6. The wafer-level optoelectronic device substrate of claim 1 , wherein each of the substrate portions comprises a plurality of optoelectronic devices mounted thereon.
7. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises:
an optoelectronic device mounted on the substrate; and
an electrical conductor extending from a front surface of the substrate to a back surface of the substrate in electrical communication with the optoelectronic device for passing signals to the optoelectronic device.
8. The wafer-level optoelectronic device substrate of claim 7 , wherein the substrate is a silicon wafer.
9. The wafer-level optoelectronic device substrate of claim 7 , further comprising an encapsulant over each of the optoelectronic devices.
10. The wafer-level optoelectronic device substrate of claim 7 , wherein the optoelectronic device is a light emitting diode.
11. The wafer-level optoelectronic device substrate of claim 7 , further comprising a driver in each substrate portion.
12. The wafer-level optoelectronic device substrate of claim 7 , wherein each of the substrate portions comprises a plurality of optoelectronic devices mounted thereon.
13. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises:
a trench in a surface thereof; and
an optoelectronic device mounted on the substrate in the trench; and
an encapsulant over the optoelectronic device forming a surface thereover, wherein the optoelectronic device substrate has an optical path which passes through the encapsulant surface.
14. The wafer-level optoelectronic device substrate of claim 13 , wherein the substrate is a silicon wafer.
15. The wafer-level optoelectronic device substrate of claim 13 , wherein the optoelectronic device is a light emitting diode.
16. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises an optoelectronic device mounted thereon and an encapsulant over the optoelectronic device, wherein the encapsulant forms a surface over the optoelectronic device and the optoelectronic device substrate has an optical path which passes through the encapsulant surface.
17. The wafer-level optoelectronic device substrate of claim 16 , wherein the substrate is a silicon wafer.
18. The wafer-level optoelectronic device substrate of claim 16 , further comprising a driver in each substrate portion.
19. The wafer-level optoelectronic device substrate of claim 16 , wherein the optoelectronic device is a light emitting diode.