GaN laser with refractory metal ELOG masks for intracavity contact
View Patent ↗Refractory metal ELOG mask are used for GaN based VCSELs and edge emitter structures to serve as intracavity contacts. In these structures the refractory metal ELOG masks serve both as ohmic contact metals as well as masks for ELOG.
1. A nitride semiconductor laser structure comprising:
a plurality of semiconductor layers;
an active region surrounded by said plurality of semiconductor layers;
an upper and lower reflector located on opposite sides of said active region;
a first refractory metal layer disposed parallel to and penetrating into at least one of said plurality of semiconductor layers such that said first refractory metal layer is disposed on a first side of said active region; and
a first metal contact electrically coupled to said first refractory metal layer;
wherein said first refractory metal layer is positioned at a null of a standing wave capable of being generated between said upper and said lower reflector.
2. The structure of claim 1 wherein said first metal contact is an n-type metal contact.
3. The structure of claim 1 further comprising a second refractory metal layer disposed parallel to and penetrating into at least one of said plurality of semiconductor layers and located on a second side of said active region.
4. The structure of claim 3 further comprising a second metal contact electrically coupled to said second refractory metal layer.
5. The structure of claim 4 wherein said second metal contact is a p-type metal contact.
6. The structure of claim 1 further comprising a substrate on which said plurality of semiconductor layers are disposed.
7. The structure of claim 1 wherein said lower reflector is disposed deposed below said plurality of semiconductor layers.
8. The structure of claim 7 further comprising an n-metal contact adjacent to said lower reflector.
9. The structure of claim 1 wherein said active region comprises a multiple quantum well region.
10. The structure of claim 1 wherein said refractory metal layer comprises Pt.
11. The structure of claim 1 wherein said refractory metal layer comprises W.
12. The structure of claim 1 wherein said refractory metal layer comprises Re.
13. The structure of claim 1 wherein said refractory metal layer comprises Mo.
14. The structure of claim 1 wherein said refractory metal layer comprises Cr.
15. The structure of claim 1 wherein said refractory metal layer comprises Ni.
16. The structure of claim 1 wherein said refractory metal layer comprises Pd.
17. A method for a nitride semiconductor laser structure comprising:
providing a plurality of semiconductor layers;
surrounding an active region by said plurality of semiconductor layers;
providing an upper and lower reflector located on opposite sides of said active region;
disposing a first refractory metal layer parallel to and penetrating into at least one of said plurality of semiconductor layers such that said first refractory metal layer is disposed on a first side of said active region; and
providing a first metal contact electrically coupled to said first refractory metal layer;
wherein said first refractory metal layer is positioned at a null of a standing wave capable of being generated between said upper and said lower reflector.
18. The method of claim 17 wherein said first metal contact is an n-type metal contact.
19. The method of claim 17 further comprising a second refractory metal layer disposed parallel to and penetrating into at least one of said plurality of semiconductor layers and located on a second side of said active region.