Semiconductor device
View Patent ↗To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.
1. A semiconductor device comprising:
a resin package;
at least two main leads integrated within the resin package so as to constitute a chip mounting portion;
a semiconductor chip mounted on the chip mounting portion; and
first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip, wherein:
the main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively, and
the main leads include a plurality of leads, the plurality of leads each having a larger width than the first and second surface leads or being configured such that the gap therebetween becomes smaller than that between the first and second surface leads in protruding regions of the main leads protruding outward from the resin package, wherein
the main leads and the first surface lead and the second surface lead are extended from the resin package outward in parallel to each other.
2. The semiconductor device according to claim 1 ,
wherein the first and second surface leads are provided so as to be symmetrical with respect to a center line of the resin package in a protruding region thereof.
3. The semiconductor device according to claim 1 ,
wherein the semiconductor chip is mounted on the chip mounting portion with a face thereof up.
4. The semiconductor device according to claim 1 ,
wherein the main leads and the first and second surface leads are bent within the resin package, respectively.
5. The semiconductor device according to claim 1 ,
wherein the chip mounting portion is formed on surfaces of the main leads which are located at an upper surface side of the resin package.
6. The semiconductor device according to claim 1 , wherein at least one of the main leads has a width that is greater than the width of the first and second surface leads.
7. A semiconductor device comprising:
a resin package;
at least two main leads integrated within the resin package so as to constitute a chip mounting portion;
a semiconductor chip mounted on the chip mounting portion; and
first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip, wherein:
the main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively, and
the resin package is configured such that the distance from an upper surface of the semiconductor chip to an upper surface of the resin package is 0.25 to 0.40 mm.
8. The semiconductor device according to claim 7 ,
wherein the main leads and the first and second surface leads are bent within the resin package, respectively.
9. The semiconductor device according to claim 7 ,
wherein the chip mounting portion is formed on surfaces of the main leads which are located at an upper surface side of the resin package.
10. A semiconductor device comprising:
a resin package;
at least two main leads integrated within the resin package so as to constitute a chip mounting portion;
a semiconductor chip mounted on the chip mounting portion; and
first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip, wherein:
the main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively,
the main leads is formed with an opening, and
a sealing resin constituting the resin package is filled in the opening formed in the main leads.
11. The semiconductor device according to claim 10 ,
wherein the main leads and the first and second surface leads are bent within the resin package, respectively.
12. The semiconductor device according to claim 10 ,
wherein the chip mounting portion is formed on surfaces of the main leads which are located at an upper surface side of the resin package.