Semiconductor pressure sensor
View Patent ↗A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.
1. A semiconductor pressure sensor having a diaphragm that is adapted to move in response to the pressure of a fluid to be measured, said diaphragm comprising:
a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein; and
a shield film for electromagnetic shielding formed on a surface of said silicon substrate at a side thereof at which said fluid to be measured is in contact with said silicon substrate;
wherein said shield film is electrically connected to said silicon substrate so as to have the same potential as that of said silicon substrate, and
wherein a reference potential film, which is electrically connected to said shield film and serves to apply a voltage to said bridge circuit, is formed on a surface of said silicon substrate at a side thereof remote from said shield film.
2. The semiconductor pressure sensor as set forth in claim 1 , wherein said shield film is made of polysilicon.
3. The semiconductor pressure sensor as set forth in claim 2 , wherein the thickness of said shield film is 1/50 or less of the thickness of said diaphragm excluding said shield film.
4. The semiconductor pressure sensor as set forth in claim 2 , wherein the resistivity of said shield film is 7.5×103Ω·cm or less.
5. The semiconductor pressure sensor as set forth in claim 1 , wherein said shield film is directly connected with pads which are electrically connected to said reference potential film for applying a voltage from the outside to said reference potential film.
6. The semiconductor pressure sensor as set forth in claim 1 , wherein a protective film for physically protecting a surface of said shield film is formed on the surface of said shield film at a side thereof remote from said silicon substrate.