IP Library Granted Patent US 7,615,800
Granted Patent B2
US 7,615,800 · App. 11/226,622 · Granted Nov 10, 2009

Quantum dot light emitting layer

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,615,800
App. No.
11/226,622
Granted
Nov 10, 2009
Kind
B2
Abstract

An inorganic light emitting layer having a plurality of light emitting cores, each core having a semiconductor material that emits light in response to recombination of holes and electrons, each such light emitting core defining a first bandgap; a plurality of semiconductor shells formed respectively about the light emitting cores to form core/shell quantum dots, each such semiconductor shell having a second bandgap wider than the first bandgap; and a semiconductor matrix connected to the semiconductor shells to provide a conductive path through the semiconductor matrix and to each such semiconductor shell and its corresponding light emitting core so as to permit the recombination of holes and electrons.

Claims (38)

1. An inorganic light emitting layer comprising:

(a) a plurality of light emitting cores, each core having a semiconductor material that emits light in response to recombination of holes and electrons, each such light emitting core defining a first bandgap;

(b) a semiconductor shell formed completely around each light emitting core to form core/shell quantum dots, each such semiconductor shell having a second bandgap wider than the first bandgap; and

(c) a semiconductor matrix including separate inorganic nanoparticles made of Type IV, III-V, or II-VI semiconductor material connected to the semiconductor shells to provide a conductive path through the semiconductor matrix and to each such semiconductor shell and its corresponding light emitting core so as to permit the recombination of holes and electrons, the inorganic nanoparticles having a different composition from that of the core/shell quantum dots.

2. The inorganic light emitting layer of claim 1 wherein each light emitting core includes a Type IV, III-V, or II-VI semiconductor material.

3. The inorganic light emitting layer of claim 2 wherein each light emitting core includes CdSe.

4. The inorganic light emitting layer of claim 1 wherein each semiconductor shell includes a Type II-VI semiconductor material.

5. The inorganic light emitting layer of claim 4 wherein each semiconductor shell includes ZnS.

6. The inorganic light emitting layer of claim 2 wherein each semiconductor shell includes a Type II-VI semiconductor material.

7. The inorganic light emitting layer of claim 1 wherein the bandgap of the semiconductor matrix material is within 0.2 eV of the bandgap of the semiconductor shell material.

8. A method of making an organic light emitting device comprising:

(a) a plurality of light emitting cores, each core having a semiconductor material that emits light in response to recombination of holes and electrons, each such light emitting core defining a first bandgap;

(b) a semiconductor shell formed completely around each light emitting core to form core/shell quantum dots, each such semiconductor shell having a second bandgap wider than the first bandgap; and

(c) a semiconductor matrix including separate inorganic nanoparticles made of Type IV, III-V, or II-VI semiconductor material connected to the semiconductor shells to provide a conductive path through the semiconductor matrix and to each such semiconductor shell and its corresponding light emitting core so as to permit the recombination of holes and electrons, the inorganic nanoparticles having a different composition from that of the core/shell quantum dots; further including:

(d) providing a colloidal dispersion of the core/shell quantum dots and semiconductor matrix nanoparticles;

(e) depositing the colloidal dispersion to form a film; and

(f) annealing the film to form an inorganic light emitting layer.

9. The method of claim 8 wherein the layer thickness is 10 to 100 nm.

10. The method of claim 8 wherein the deposited film is annealed at a temperature between 250 and 300 C for up to 60 minutes.

11. An inorganic light emitting device according to claim 1 comprising:

(a) spaced anode and cathode electrodes; and

(b) the inorganic light emitting layer disposed between the anode and cathode electrodes.

12. The inorganic light emitting device of claim 11 including a p-type transport layer disposed between the anode and inorganic light-emitting layer.

13. The inorganic light emitting device of claim 12 wherein the p-type transport layer includes p-type ZnSe, ZnS, or ZnTe.

14. The inorganic light emitting device of claim 12 wherein the conductivity of the p-type transport layer is enhanced by a dopant including nitrogen or lithium or both.

15. The inorganic light emitting device of claim 11 including a n-type transport layer disposed between the cathode and inorganic light-emitting layer.

16. The inorganic light emitting device of claim 15 wherein the n-type transport layer includes n-type ZnSe or ZnS.

17. The inorganic light emitting device of claim 15 wherein the conductivity of the n-type transport layer is enhanced by a Type III dopant including Al, In, or Ga.

18. The inorganic light emitting device of claim 12 including a n-type transport layer disposed between the cathode and inorganic light-emitting layer.

19. The inorganic light emitting device of claim 18 wherein the n-type transport layer includes n-type ZnSe, or ZnS.

20. The inorganic light emitting device of claim 18 wherein the conductivity of the n-type transport layer is enhanced by a Type III dopant including Al, In, or Ga.

21. An inorganic light emitting device according to claim 1 comprising:

(a) a substrate;

(a) an anode formed on the substrate and a cathode spaced from the anode; and

(b) the inorganic light emitting layer disposed between the anode and cathode.

22. The inorganic light emitting device of claim 21 wherein the substrate includes p-type semiconductor material.

23. The inorganic light emitting device of claim 22 wherein the light emitting layer is formed on one side of the substrate and the anode is formed on the other side of the substrate.

24. The inorganic light emitting device of claim 21 wherein the substrate is formed of glass, metal foil, or plastic and the anode is formed on the substrate.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUALEX, INC.; EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2018
From: EASTMAN KODAK COMPANY
To: NANOCO TECHNOLOGIES LIMITED
Reel/Frame 045143/0757 →
RELEASE OF SECURITY INTEREST Recorded Feb 1, 2017
From: BANK OF AMERICA, N.A.
To: EASTMAN KODAK COMPANY
Reel/Frame 041144/0090 →
RELEASE OF SECURITY INTEREST Recorded Feb 1, 2017
From: JP MORGAN CHASE BANK N.A.
To: EASTMAN KODAK COMPANY
Reel/Frame 041144/0005 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
PATENT SECURITY AGREEMENT Recorded Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →
SECURITY INTEREST Recorded Feb 21, 2012
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: CITICORP NORTH AMERICA, INC., AS AGENT
Reel/Frame 028201/0420 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2005
From: KAHEN, KEITH B.
To: EASTMAN KODAK COMPANY
Reel/Frame 016994/0126 →