IP Library Granted Patent US 7,653,998
Granted Patent B1
US 7,653,998 · App. 11/226,754 · Granted Feb 2, 2010

Wound process element and method of production

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Quick Facts
Patent No.
US 7,653,998
App. No.
11/226,754
Granted
Feb 2, 2010
Kind
B1
Abstract

A wound process element and method of assembly wherein at least one dimpling element is positioned between the outer perimeter of a wound element strip and an outer holding band.

Claims (12)

1. In a process element including a wound element strip, said wound element strip being wound in a circular pattern and having an outer perimeter, and a holding band having a substantially cylindrical inner surface which is secured around and in contact with said outer perimeter of said wound element strip, the improvement comprising at least one dimpling element positioned and squeezed between said substantially cylindrical inner surface of said holding band and said wound element strip at a dimpling location in a manner effective such that an arched dimple, induced by said dimpling element, is formed in a portion of said outer perimeter of said wound element strip at said dimpling location and wherein, except for said portion of said outer perimeter in which said arched dimple is formed, said outer perimeter of said wound element strip remains in contact with said substantially cylindrical inner surface of said holding band.

2. The process element of claim 1 wherein the improvement further comprises said dimpling element being attached to said holding band.

3. The process element of claim 1 wherein the improvement further comprises at least one cover plate positioned on an end of said dimpling element in a manner effective to substantially prevent flow from occurring through one or more gaps formed by said dimpling element between said holding band and said wound element strip.

4. The process element of claim 3 wherein the improvement further comprises said cover plate being attached to said holding band.

5. The process element of claim 3 wherein the improvement further comprises said cover plate being attached to said end of said dimpling element.

6. The process element of claim 1 wherein the improvement further comprises said dimpling element being substantially cylindrical.

7. The process element of claim 1 wherein the improvement further comprises said dimpling element having a substantially D-shaped cross-section.

8. The process element of claim 1 wherein the improvement further comprises a plurality of said dimpling elements positioned between said holding band and said wound element strip.

9. The process element of claim 8 wherein the improvement further comprises said dimpling elements being grouped in a substantially triangular pattern.

10. The process element of claim 1 wherein the improvement further comprises:

said process element being a catalytic converter element and

said wound element strip being a wound catalyst foil strip.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2024
From: MEDLEY CAPITAL CORPORATION
To: MIRATECH GROUP, LLC
Reel/Frame 068214/0454 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 033032/0707 Recorded Mar 10, 2017
From: MEDLEY CAPITAL CORPORATION
To: MIRATECH GROUP, LLC
Reel/Frame 041966/0585 →
SECURITY INTEREST Recorded May 27, 2014
From: MIRATECH GROUP, LLC
To: MEDLEY CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 033032/0707 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: MIRATECH INTERMEDIATE HOLDINGS, INC.
To: MIRATECH GROUP, LLC
Reel/Frame 032905/0324 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: MIRATECH HOLDINGS, LLC
To: MIRATECH HOLDINGS, INC.
Reel/Frame 032904/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: MIRATECH HOLDINGS, INC.
To: MIRATECH INTERMEDIATE HOLDINGS, INC.
Reel/Frame 032905/0128 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2011
From: MIRATECH CORPORATION
To: MIRATECH HOLDINGS, LLC
Reel/Frame 026602/0411 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2009
From: MIRATECH SCR CORPORATION
To: MIRATECH HOLDINGS, LLC
Reel/Frame 023234/0259 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2005
From: LAMBERT, DONALD C.; SARTAIN, JOHN W.; HUFF, NICHOLAS J.
To: MIRATECH CORPORATION
Reel/Frame 016980/0854 →