IP Library Granted Patent US 7,562,830
Granted Patent B2
US 7,562,830 · App. 11/227,819 · Granted Jul 21, 2009

Temperature controller

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,562,830
App. No.
11/227,819
Granted
Jul 21, 2009
Kind
B2
Abstract

A temperature controller that combines a solid state relay with internal circuitry that generates temperature control output for heating element loads or cooling compressor loads ranging from 24VAC up to 530VAC and at 25A up to 90A. A logic supply and control connectors provides connectors for various inputs. Power switch terminals connect the temperature controller to the heating element or cooling motor to be temperature controlled. Thermocouple terminals receive the leads from a type J or type K thermocouple from the heating element or cooling motor. The temperature controller rapidly and accurately senses, controls, and maintains the temperature of any process associated with a load. The temperature control output signal leaving the power switch controls the load in order to maintain a constant temperature delivered to the process. The temperature controller requires only a single non-regulated low current isolated DC supply to work the logic circuitry.

Claims (42)

1. A method for controlling the temperature of a process, the method comprising the steps of:

(a) regulating a direct current received in a temperature controller;

(b) detecting an on condition and an off condition in said temperature controller;

(c) amplifying and conditioning an input signal, received from a thermocouple connected to a process, in said temperature controller;

(d) receiving and updating a setpoint value in said temperature controller;

(e) generating a temperature control output signal in a processor in said temperature controller;

(f) receiving said temperature control output signal from said processor in an isolated barrier in said temperature controller; and

(g) switching said temperature control output signal from said isolated barrier to a load associated with said process.

2. The method according to claim 1 wherein step (b) further comprises the step of:

detecting said on condition and said off condition in said temperature controller through an on/off switch connectible to said temperature controller.

3. The method according to claim 1 wherein step (d) further comprises the step of:

receiving and updating said setpoint value through an analog signal interface connectable to said temperature controller.

4. The method according to claim 1 wherein step (e) further comprises the step of:

generating said temperature control output signal for a heating element load.

5. The method according to claim 1 wherein step (e) further comprises the step of:

generating said temperature control output signal for a cooling compressor load.

6. The method according to claim 1 wherein step (g) further comprises the step of:

switching said temperature control output signal to said load through a power switch circuit, wherein said power switch circuit is a solid state relay.

7. The method according to claim 1 further comprising the step of:

indicating a current operating status of said temperature controller through energizing a heat-on indicator light emitting diode and a set-temp indicator light emitting diode.

8. A temperature controller circuit comprising:

a processor;

a regulator circuit connected to said processor that regulates a direct current;

a control signal circuit connected to said processor that detects an on condition and an off condition;

an amplifier circuit connected to said processor that amplifies and conditions an input signal from a thermocouple connected to a process;

a signal conditioner circuit connected to said processor that receives and updates a setpoint value;

an isolated barrier circuit connected to said processor that receives a temperature control output signal from said processor; and

a power switch circuit connected to said isolated barrier circuit that switches said temperature control output signal from said processor to a load associated with said process in order to control a temperature of said process.

9. The temperature controller circuit according to claim 8 further comprising:

an isolated direct current supply connectable to said regulator circuit that provides operating power to the temperature controller circuit.

10. The temperature controller circuit according to claim 8 further comprising:

an on/off switch connectable to said control signal circuit to enable and disable said power switch circuit.

11. The temperature controller circuit according to claim 8 further comprising:

an analog signal interface connectable to said signal conditioner circuit to set and update said setpoint value.

12. The temperature controller circuit according to claim 8 wherein said power switch circuit is a solid state relay.

13. The temperature controller circuit according to claim 8 wherein said load is a [sic]one of a heating element load and a cooling compressor load.

14. The temperature controller circuit according to claim 8 further comprising:

a heat-on indicator light emitting diode connected to said processor; and

a set-temp indicator light emitting diode connected to said processor;

wherein said heat-on indicator light emitting diode and said set-temp indicator light emitting diode are controlled by said processor and indicate a current operating status of the temperature controller circuit.

15. The temperature controller circuit according to claim 14 further comprising:

a standard size package for housing said processor, said regulator circuit, said control signal circuit, said amplifier circuit, said signal conditioner circuit, said isolated barrier circuit, said power switch circuit, said heat-on indicator light emitting diode, and said set-temp indicator light emitting diode.

Assignments (6)
SECURITY INTEREST Recorded Feb 25, 2016
From: BEI NORTH AMERICA LLC; CRYDOM, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; KAVLICO CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037927/0605 →
RELEASE OF SECURITY INTEREST Recorded Dec 2, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; CRYDOM, INC.; BEI TECHNOLOGIES, INC.; KAVLICO CORPORATION
Reel/Frame 037196/0174 →
SECURITY AGREEMENT Recorded Oct 3, 2014
From: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC; CRYDOM, INC.; BEI TECHNOLOGIES, INC.; KAVLICO CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 033888/0700 →
CHANGE OF NAME Recorded Aug 18, 2010
From: CROUZET, INC.
To: CRYDOM, INC.
Reel/Frame 024850/0199 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2010
From: CRYDOM TECHNOLOGIES
To: CROUZET, INC.
Reel/Frame 024850/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2005
From: OROZCO, SERGIO
To: CRYDOM TECHNOLOGIES
Reel/Frame 016798/0034 →