IP Library Granted Patent US 7,283,400
Granted Patent B2
US 7,283,400 · App. 11/228,389 · Granted Oct 16, 2007

Nonvolatile semiconductor storage device

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Quick Facts
Patent No.
US 7,283,400
App. No.
11/228,389
Granted
Oct 16, 2007
Kind
B2
Abstract

A nonvolatile memory device of the present invention performs a programming operation by accumulating a charge in certain capacitance which is provided for each programming memory cell and injecting hot electrons generated when the charge is discharged via the memory cell into a floating gate. Thus, a variation in a programming characteristic of the nonvolatile semiconductor memory device is reduced, thereby realizing high-speed programming operation.

Claims (36)

1. A nonvolatile semiconductor memory device comprising:

a memory cell including first and second diffusion layers, a charge-storage portion between the first and second diffusion layers, a gate between the charge-storage portion and the first diffusion layer, and a word line formed above the charge storage portion and controlled separately from the gate;

and

a bit line connected to the memory cell;

wherein the charge storage portion is injected with hot electrons which are generated by passing charges accumulated in stray capacitance of the bit line through the memory cell at a portion in a semiconductor substrate under a boundary between the charge-storage portion and the gate when the memory cell is programmed or erased.

2. A nonvolatile semiconductor memory device according to claim 1 ,

wherein the charge storage portion is a floating gate.

3. A nonvolatile semiconductor memory device according to claim 1 ,

wherein the charge storage portion is a silicon nitride film.

4. A nonvolatile semiconductor memory device according to claim 1 ,

wherein a portion of the stray capacitance is formed of p-n junction capacitance of a diffusion layer of the memory cell.

5. A nonvolatile semiconductor memory device according to claim 1 , further comprising:

an internal power source circuit to generate a voltage to be applied to the bit line,

wherein, when the memory cell is programmed or erased, the internal power source circuit is brought to an inactive state.

6. A nonvolatile semiconductor memory device according to claim 1 ,

wherein, after the programming or the erase is performed a plurality of times, an operation of verifying a threshold voltage of the memory cell is performed.

7. A nonvolatile semiconductor memory device according to claim 6 ,

wherein the number of repeating the programming or the erase is incremented every time the threshold voltage verification operation is performed.

8. A nonvolatile semiconductor memory device comprising:

a memory cell including first and second diffusion layers, a charge-storage portion between the first and second diffusion layers, a gate between the charge-storage portion and the first diffusion layer, and a word line formed above the charge-storage portion and controlled separately from the gate;

and

a bit line connected to the memory cell;

means for injecting hot electrons into the charge-storage portion of the memory cell, which hot electrons are generated by passing charges accumulated in stray capacitance of the bit line through the memory cell at a portion in a semiconductor substrate under a boundary between the charge-storage portion and the gate, when the memory cell is programmed or erased.

9. A nonvolatile semiconductor memory device according to claim 8 ,

wherein the charge-storage portion is a floating gate.

10. A nonvolatile semiconductor memory device according to claim 8 ,

wherein the charge-storage portion is a silicon nitride film.

11. A nonvolatile semiconductor memory device according to claim 8 ,

wherein a portion of the stray capacitance is formed of p-n junction capacitance of a diffusion layer of the memory cell.

12. A nonvolatile semiconductor memory device according to claim 8 , further comprising:

an internal power source circuit to generate a voltage to be applied to the bit line,

wherein, when the memory cell is programmed or erased, the internal power source circuit is brought to an inactive state.

13. A nonvolatile semiconductor memory device according to claim 8 ,

wherein, after the programming or the erase is performed a plurality of times, an operation of verifying a threshold voltage of the memory cell is performed.

14. A nonvolatile semiconductor memory device according to claim 13 ,

wherein the number of repeating the programming or the erase is incremented every time the threshold voltage verification operation is performed.

Assignments (4)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2015
From: HITACHI DEVICE ENGINEERING CO., LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 036667/0622 →
MERGER AND CHANGE OF NAME Recorded Sep 23, 2015
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036667/0733 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →