IP Library Granted Patent US 9,006,348
Granted Patent B2
US 9,006,348 · App. 11/229,455 · Granted Apr 14, 2015

Poly aryl ether ketone polymer blends

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Quick Facts
Patent No.
US 9,006,348
App. No.
11/229,455
Granted
Apr 14, 2015
Kind
B2
Abstract

Phase separated blends of polyaryl ether ketones, polyaryl ketones, polyether ketones, polyether ether ketones and mixtures thereof with at least one polysulfone etherimide, wherein the polysulfone etherimide has greater than or equal to 50 mole % of the polymer linkages contain at least one aryl sulfone group are described. Such blends have improved load bearing capability at high temperature. In another aspect a high crystallization temperature, especially at fast cooling rates, is achieved.

Claims (25)

1. A composition comprising a polymer blend being phase separated in the solid state containing: a) a first polymer phase of a first resin component selected from one or more of the group consisting of: polyaryl ether ketones, polyaryl ketones, polyether ketones and polyether ether ketones with b) a second polymer phase of a second resin component comprising at least one polysulfone etherimide having greater than or equal to 50 mole% of the polymer linkages containing at least one aryl sulfone group;

wherein the polysulfone etherimide is derived from oxydiphthalic anhydride optionally in combination with bisphenol A dianhydride, and diaminodiphenyl sulfone;

wherein the ratio of the first component to the second component, in parts by weight is from 99:1 to 60:40;

wherein the composition has a crystallization temperature, as measured from a molten polymer mixture cooled at a rate of 80 ° C/min., that is greater than or equal to the crystallization temperature of the first resin component, and

wherein the composition has at least two glass transition temperatures, as measured by ASTM method D5418, wherein the first glass transition temperature is from 120-200 ° C. and the second glass transition temperature is from 240-350 ° C.

2. The composition of claim 1 , wherein at least 50 mole% of the polysulfone etherimide linkages are derived from oxydiphthalic anhydride or a chemical equivalent thereof.

3. The composition of claim 1 , wherein less than 30 mole% of polysulfone etherimide linkages are derived from a diamine or dianhydride containing an isoalkylidene group.

4. The composition of claim 1 , wherein the composition has a heat distortion temperature (HDT) of greater than or equal to 170 ° C., measured as per ASTM method D648 at 66 psi (0.46 Mpa) on a 3.2 mm sample.

5. The composition of claim 1 , wherein the ratio of the first component to the second component, in parts by weight is from 85:15 to 75:25.

6. The composition of claim 1 , having less than 5 wt% fibrous reinforcement.

7. The composition of claim 1 , having a modulus of greater than about 200 Mpa at 200 ° C., as measured by ASTM D5418, on a 3.2 mm sample.

8. The composition of claim 1 , having a melt viscosity, as measured by ASTM method D3835 at 380 ° C. from 200-10,000 Pascal-seconds.

9. The composition of claim 8 , wherein the melt viscosity does not change by more than 35% of its initial value after 10 minutes at 380 ° C.

10. The composition of claim 1 , wherein the polyaryl ether ketones, polyaryl ketones, polyether ketones, and polyether ether ketones have a crystalline melting point from 300 to 380 ° C.

11. The composition of claim 1 , wherein the polysulfone etherimide has a glass transition temperature (Tg) ranging from 240 to 350 ° C.

12. The composition of claim 1 , wherein the second glass transition temperature is from about 280 to about 350 ° C.

13. The composition of claim 1 , wherein one or more properties of the polymer blend is higher than the corresponding property of resin component one and resin component two.

14. An article made from the composition of claim 1 .

15. The article of claim 14 , which is selected from the group consisting of: sheets, films, multilayer sheets, multilayer films, molded parts, extruded profiles, fibers, coated parts and foams.

16. A composition comprising a polymer blend being phase separated in the solid state containing: a) a first polymer phase of a first resin component selected from one or more of the group consisting of: polyaryl ether ketones, polyaryl ketones, polyether ketones and polyether ether ketones with b) a second polymer phase of a second resin component comprising at least one polysulfone etherimide having greater than or equal to 50 mole % of the polymer linkages containing at least one aryl sulfone group and made by reaction of 4,4′-oxydiphthalic anhydride with about an equal molar amount of 4,4′-diamino diphenyl sulfone; wherein less than 10 mole % isoalkylidene groups are present in the polysulfone etherimide linkages, and wherein the composition does not contain a polysulfone etherimide made from reaction of bisphenol-A dianhydride (BPADA) with about an equal molar amount of 4,4′-diamino diphenyl sulfone;

wherein the ratio of the first component to the second component, in parts by weight is from 99:1 to 60:40;

wherein the polysulfone etherimide is essentially free of benzylic protons;

wherein the composition has a crystallization temperature, as measured from a molten polymer mixture cooled at a rate of 80° C./min., that is greater than or equal to about 250° C., and

wherein the composition has at least two glass transition temperatures, as measured by ASTM method D5418, wherein the first glass transition temperature is from 120-200° C. and the second glass transition temperature is from 240-350° C.

17. The composition of claim 16 , wherein the polysulfone etherimide does not contain any isoalkylidene groups in the polysulfone etherimide linkages.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE APPLICATION NUMBER 15039474 PREVIOUSLY RECORDED AT REEL: 054528 FRAME: 0467. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 23, 2021
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 057453/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2020
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 054528/0467 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 12/116841, 12/123274, 12/345155, 13/177651, 13/234682, 13/259855, 13/355684, 13/904372, 13/956615, 14/146802, 62/011336 PREVIOUSLY RECORDED ON REEL 033591 FRAME 0673. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 29, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033663/0427 →
CORRECTIVE ASSIGNMENT TO CORRECT REMOVE 10 APPL. NUMBERS PREVIOUSLY RECORDED AT REEL: 033591 FRAME: 0673. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 28, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033649/0529 →
CHANGE OF NAME Recorded Aug 22, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033591/0673 →
RELEASE OF SECURITY INTEREST Recorded Mar 17, 2014
From: CITIBANK, N.A.
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 032459/0798 →
SECURITY AGREEMENT Recorded Aug 18, 2008
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 021423/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2008
From: GENERAL ELECTRIC COMPANY
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 020985/0551 →