Chip cooling system
View Patent ↗A chip cooling system including a semiconductor device having a bulk region, wherein at least one fluid channel extends at least partially through the bulk region, the fluid channel having an inlet and an outlet, a fluid inlet port in fluid communication with the channel inlet, and a fluid outlet port in fluid communication with the channel outlet, and a cooling fluid flows from the fluid inlet port, through the fluid channel and to the fluid outlet port to cool the bulk region.
1. A chip cooling system comprising:
a semiconductor device having a bulk region, said bulk region having at least one fluid channel said fluid channel including a plurality of angled and interconnecting bores forming a zig-zag pattern extending at least partially therethrough, said fluid channel having an inlet and an outlet;
a fluid inlet port in fluid communication with said channel inlet; and
a fluid outlet port in fluid communication with said channel outlet;
wherein said fluid inlet port, inlet, channel, outlet and outlet port allow a cooling fluid to flow through and cool said bulk region.
2. The chip cooling system of claim 1 wherein said semiconductor device is a silicon wafer.
3. The chip cooling system of claim 1 further comprising a circuit board, wherein said semiconductor device is connected to said circuit board.
4. The chip cooling system of claim 3 wherein said semiconductor device is connected to said circuit board with solder.
5. The chip cooling system of claim 3 wherein said fluid inlet port and said fluid outlet port extend through said circuit board.
6. The chip cooling system of claim 1 wherein said fluid channel is etched into said bulk region of said semiconductor device.
7. The chip cooling system of claim 6 wherein fluid channel is etched using a deep reactive ion etching process.
8. A chip cooling system comprising:
a semiconductor device having a bulk region, wherein a continuous etched channel having zip-zag shape and extends at least partially through said bulk region; and
a cooling fluid contained in said channel.
9. The chip cooling system of claim 8 , wherein said semiconductor device is a silicon wafer.
10. The chip cooling system of claim 8 , further comprising a circuit board, wherein said semiconductor device is soldered to said circuit board.
11. The chip cooling system of claim 8 , further comprising a fluid inlet port and a fluid outlet port in fluid communication with said channel.
12. The chip cooling system of claim 8 , wherein channel is formed using a deep reactive ion etching process.