Methods for making micro-fluid ejection head structures
View Patent ↗Methods of making micro-fluid ejection head structures. One of the methods includes providing a substrate having a plurality fluid ejection actuators on a device surface thereof. The device surface of the substrate also has a thick film layer comprising at least one of fluid flow channels and fluid ejection chambers therein. A removable anti-reflective material is applied to at least one or more exposed portions of the device surface of the substrate. A nozzle layer is applied adjacent to the thick film layer. The nozzle layer is imaged to provide a plurality of nozzles in the nozzle layer, and the non-reflective material is removed from the exposed portions of the device surface of the substrate.
1. A method of making a micro-fluid ejection head structure comprising a substrate having a plurality of fluid ejection actuators on a device surface thereof and having a thick film layer comprising at least one of fluid flow channels and fluid ejection chambers therein, the method comprising:
applying a removable anti-reflective material to at least one or more exposed portions of the device surface of the substrate;
applying a nozzle layer adjacent to the thick film layer;
imaging a plurality of nozzles in the nozzle layer; and
removing the anti-reflective material from the exposed portions of the device surface of the substrate to which the anti-reflective material has been applied.
2. The method of claim 1 , wherein the removable anti-reflective material is selected from the group consisting of materials having a lower index of refraction than an index of refraction of the nozzle layer at a wavelength used to image the nozzle layer; materials that absorb ultraviolet radiation at a wavelength used to image the nozzle layer, and materials that have a lower index of refraction and that absorb ultraviolet radiation at a wavelength used to image the nozzle layer.
3. The method of claim 2 , wherein the anti-reflective material is selected from the group consisting of a photoresist material containing an ultraviolet absorbent filler, an ultraviolet absorbent polyimide, an ultraviolet absorbent acrylic, a water soluble polyacrylamide, a water soluble poly vinyl acetate, and a water soluble polyethylene oxide.
4. The method of claim 1 , wherein the anti-reflective material is selected from the group consisting of a photoresist material containing an ultraviolet absorbent filler, an ultraviolet absorbent polyimide, an ultraviolet absorbent acrylic, a water soluble polyacrylamide, a water soluble poly vinyl acetate, and a water soluble polyethylene oxide.
5. The method of claim 1 , wherein the anti-reflective material is selected from the group of positive photoresist materials containing a pigment filler, negative photoresist materials containing a pigment filler, positive photoresist materials containing a dye filler, and negative photoresist materials containing a dye filler, wherein the fillers are sufficient to absorb ultraviolet radiation.
6. The method of claim 1 , wherein the anti-reflective material is applied to the exposed portions of the device surface of the substrate through a fluid supply slot in the substrate.
7. The method of claim 1 , wherein the anti-reflective material is applied to the exposed portions of the device surface of the substrate by a process selected from the group consisting of spin-coating, spray coating, and screen printing.
8. The method of claim 1 , wherein the anti-reflective material is applied to the exposed portions of the device surface of the substrate with a thickness ranging from about 300 nanometers to about a thickness of the thick film layer.
9. The method of claim 1 , wherein the act of imaging a plurality of nozzles in the nozzle layer further comprises developing the nozzles.
10. The method of claim 1 , wherein the act of imaging a plurality of nozzles comprises laser ablating a plurality of nozzles in the nozzle layer.
11. A method for providing an improved micro-fluid ejection head nozzle member having improved nozzle characteristics, the method comprising:
imaging a nozzle layer in the presence of a removable anti-reflective material covering at least exposed portions of a device surface of a substrate to which the nozzle layer is attached, the head nozzle member also having a thick film layer disposed between the substrate and the nozzle layer and comprising at least one of fluid flow channels and fluid ejection chambers therein; and
removing the removable anti-reflective layer from the substrate to which the nozzle member is attached.
12. The method of claim 11 , wherein the exposed portions of the device surface of the substrate comprise fluid ejector actuators and electrical contacts.
13. The method of claim 11 , wherein the removable anti-reflective material is selected from the group consisting of materials having a lower index of refraction than an index of refraction of the nozzle layer at a wavelength used to image the nozzle layer; materials that absorb ultraviolet radiation at a wavelength used to image the nozzle layer, and materials that have a lower index of refraction and that absorb ultraviolet radiation at a wavelength used to image the nozzle layer.
14. The method of claim 13 , wherein the anti-reflective material is selected from the group consisting of a photoresist material containing an ultraviolet absorbent filler, an ultraviolet absorbent polyimide, an ultraviolet absorbent acrylic, a water soluble polyacrylamide, a water soluble poly vinyl acetate, and a water soluble polyethylene oxide.
15. The method of claim 11 , wherein the antireflective material is selected from the group consisting of a photoresist material containing an ultraviolet absorbent filler, an ultraviolet absorbent polyimide, an ultraviolet absorbent acrylic, a water soluble polyacrylamide, a water soluble poly vinyl acetate, and a water soluble polyethylene oxide.
16. The method of claim 11 , wherein the anti-reflective material is applied to the substrate to cover the exposed portions of the device surface of the substrate through a fluid supply slot in the substrate.
17. The method of claim 11 , wherein the anti-reflective material is applied to the substrate to cover exposed portions of the device surface of the substrate by a process selected from the group consisting of spin-coating, spray coating, and screen printing.
18. The method of claim 11 , wherein the anti-reflective material has a thickness ranging from about 300 nanometers to about 30 microns.
19. The method of claim 11 , further comprising developing the imaged nozzle layer to provide a plurality of nozzles therein.
20. The method of claim 11 , wherein the act of imaging a nozzle layer comprises laser ablating the nozzle layer to provide a plurality of nozzles therein.