Deterministic generation of an integrated circuit identification number
The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip among several first conductive sections parallel to one another and perpendicular to at least one edge of the chip, the first sections being individually connected, by at least one of their ends, to the chip, and exhibiting different lengths, the position of the cutting line with respect to the chip edge conditioning the identification number.
1. An integrated circuit chip comprising,
on at least one side, at least two conductive sections having two end terminals connected to the inside of the chip to generate an identification number thereof, the generation of the identification number dependent on the position of a cutting line with respect to the corresponding edge of the chip; and
a read circuit coupled to each conductive section and operable to determine the state of each section.
2. The chip of claim 1 , comprising a circuit of excitation of at least one of the conductive sections at one of its ends and of reading of the voltage at its other end.
3. The chip of claim 1 , obtained by the implementation of the method of claim 1 .
4. An integrated circuit chip, comprising:
a first edge; and
first conductive paths disposed on the first edge, each one having a closed or open state, wherein a combination of the states identifies the chip; and
a reading circuit coupled to each conductive path and operable to read the states of the first conductive paths.
5. The chip of claim 4 , wherein the conductive paths have different lengths.
6. The chip of claim 4 , further comprising an end terminal operable to provide an input voltage to each of the conductive paths.
7. The chip of claim 4 , wherein the read circuit is further operable to generate an identification value as a function of the states.
8. The chip of claim 7 , wherein the identification value comprises a binary word.
9. The chip of claim 7 , wherein the identification value identifies a position the chip occupied on a wafer prior to being removed from the wafer.
10. The chip of claim 7 , wherein the read circuit is further operable to store the identification value.
11. The chip of claim 4 , further comprising:
a second edge; and
second conductive paths disposed on the second edge, each one having a closed or open state.
12. An integrated circuit chip, comprising:
a first edge;
first conductive paths disposed on the first edge, each one having a closed or open state, wherein a combination of the states identifies the chip a second edge;
second conductive paths disposed on the second edge, each one having a closed or open state; and
a read circuit coupled to each of the first conductive paths and each of the second conductive paths and operable to determine the state of each path.
13. The chip of claim 12 , wherein the read circuit is further operable to generate an identification value as a function of the states.
14. An integrated circuit, comprising:
an integrated circuit chip including,
a first edge;
first conductive paths disposed on the first edge, each one having a closed or open state, wherein a combination of the states identifies the chip;
a read circuit coupled to each of the first conductive paths and operable to determine the state of each path; and
a memory having an identification stored therein, the identification generated from the combination of states of the first conductive paths.
15. A system, comprising:
a first integrated circuit including,
a first edge; and
first conductive paths disposed on the first edge, each one having a closed or open state, wherein a combination of the states identifies the chip; and
a reading circuit coupled to each conductive path and operable to read the states of the first conductive paths.
16. The system of claim 15 , further comprising a second integrated circuit coupled to the first integrated circuit such that the second integrated circuit controls the first integrated circuit.
17. The system of claim 16 wherein the first and second integrated circuits are disposed on an integrated circuit chip.
18. The system of claim 15 wherein at least one path is in a closed state and one path is in an open state.
19. An integrated circuit, comprising:
a circuit portion having circuit nodes;
a first edge disposed adjacent to the circuit portion;
conductive paths disposed on the first edge, each conductive path coupled between a respective pair of the circuit nodes such that a conductive path has a closed state if the path electrically couples together the respective pair of nodes and has an open state if the path does not electrically couple together the respective pair of nodes, at least one of the conductive paths having a closed state; and
a reading circuit coupled to each conductive path operable to store an identifier based on the states of the conductive paths.
20. The integrated circuit of claim 19 wherein at least one of the conductive paths has an open state.
21. The integrated circuit of claim 19 wherein a length of a first one of the conductive paths is different than a length of a second conductive path.