IP Library Granted Patent US 7,635,874
Granted Patent B2
US 7,635,874 · App. 11/235,592 · Granted Dec 22, 2009

Edge-emitting LED assembly

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Quick Facts
Patent No.
US 7,635,874
App. No.
11/235,592
Granted
Dec 22, 2009
Kind
B2
Abstract

A light-emitting diode (LED) in accordance with the invention includes an edge-emitting LED stack having an external emitting surface from which light is emitted, and a reflective element that is located adjacent to at least one external surface of the LED stack other than the external emitting surface. The reflective element receives light that is generated inside the LED stack and reflects the received light back into the LED stack. At least a portion of the reflected light is then emitted from the external emitting surface.

Claims (27)

1. A light emitting diode (LED) assembly comprising:

an edge-emitting LED stack comprising:

a first external emitting surface, the first external emitting surface configured to be non-reflective, thereby accommodating transmission of incoherent light out of the edge-emitting LED stack without reflecting light back into the edge-emitting LED stack;

a second external surface comprising a p-type contact;

a third external surface comprising an n-type contact;

a fourth external surface opposing the first external emitting surface; and

a reflective element located adjacent to at least one external surface of the LED stack, the at least one external surface excluding the first external emitting surface and the fourth external surface, the reflective element configured to reflect incoherent light that is generated in an active region of the LED stack back into the LED stack, wherefrom at least a portion of the reflected light is emitted out of the first external emitting surface along with incoherent light emitted directly from the active region of the edge-emitting LED stack.

2. The LED assembly of claim 1 , wherein the second external surface of the LED stack is an external surface of a p-type contact layer and the at least one external surface is at least a portion of the external surface of the p-type contact layer.

3. The LED assembly of claim 1 , wherein the third external surface of the LED stack is an external surface of an n-type contact layer and the at least one external surface is at least a portion of the external surface of the n-type contact layer.

4. The LED assembly of claim 1 , wherein the LED stack further comprises a second reflective element located adjacent to an internal major surface of a substrate.

5. The LED assembly of claim 1 , wherein the reflective element is a low-loss mirror having a thickness equal to a quarter-wave length of an emitted wavelength of light from the LED stack.

6. The LED assembly of claim 5 wherein the emitted wavelength of light is a mean wavelength in an emission spectrum of the LED stack.

7. The LED assembly of claim 1 , wherein the reflective element comprises:

a first reflective element having a thickness equal to a quarter-wave length of a first emitted wavelength of light from the LED stack; and

a second reflective element having a thickness equal to a quarter-wave length of a second emitted wavelength of light from the LED stack.

8. The LED assembly of claim 7 , wherein the first emitted wavelength of light and the second emitted wavelength of light are contained in an emission spectrum of the LED stack.

9. The LED assembly of claim 1 , wherein the reflective element is a multilayer reflective element, and wherein the thickness of each of the multiple layers is identical.

10. The LED assembly of claim 1 , wherein the reflective element is a multilayer reflective element, and wherein the thickness of each of the multiple layers decreases with location farther away from the at least one external surface.

11. The LED assembly of claim 1 , wherein the reflective element is a multilayer reflective element, and wherein the thickness of each of the multiple layers bears a non-linear relationship with reference to other layers of the multilayer reflective element.

12. A method of light emission, the method comprising:

generating incoherent light in an active region of an edge-emitting light emitting diode (LED) stack, the LED stack comprising a first external emitting surface; and

using a first reflective element located adjacent to at least one external surface other than a) the first external emitting surface of the LED stack and b) an opposing external surface opposed to the first emitting surface, for reflecting the generated incoherent light back into the LED stack, wherefrom at least a portion of the reflected light is emitted out of the first external emitting surface along with incoherent light emitted directly from the active region of the LED stack.

13. The method of light emission of claim 12 , further comprising:

providing a second reflective element located adjacent to at least another external surface of the LED stack.

14. The method of light emission of claim 12 , wherein the at least one external surface of the LED stack is at least a portion of an external surface of a p-type contact layer.

15. The method of light emission of claim 12 , further comprising:

providing a second reflective element located adjacent to an internal major surface of a substrate of the LED stack.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED AT REEL: 047195 FRAME: 0827. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Nov 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047924/0571 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0827 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →