Optimally shaped spreader plate for electronics cooling assembly
A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the lower and upper surfaces, moving from the central area out to the periphery. This allows the heat flux lines to be more evenly spaced and regular in length, as compared to a typical plate with flat upper and lower surfaces of equal surface area.
1. A heat spreader plate for use with a heat producing electronic component, said component having a substantially flat exposed surface of predetermined size from which heat is to be extracted, said spreader plate comprising,
a planar lower surface substantially matching the size of the exposed surface of said component and adapted to be thermally bonded thereto,
a non planar, substantially arcuate and convex upper surface of larger surface area than said lower surface and having a greatest thickness located substantially over said lower surface and diminishing in thickness moving toward the periphery of said upper surface, whereby the lines of heat flux radiating from said component and lower surface to said upper surface are substantially equal in length and substantially evenly spaced across said upper surface; wherein said component surface and plate lower surface are substantially rectangular, and said plate further has at least one pair of opposed, non parallel side surfaces diverging from said lower surface and extending to said upper surface; and wherein said side surfaces are substantially arcuate and concave.