IP Library Granted Patent US 8,329,314
Granted Patent B1
US 8,329,314 · App. 11/238,602 · Granted Dec 11, 2012

Hermetically bonding ceramic and titanium with a palladium braze

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Quick Facts
Patent No.
US 8,329,314
App. No.
11/238,602
Granted
Dec 11, 2012
Kind
B1
Abstract

A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.

Claims (3)

1. A microstimulator comprising: a component assembly housing comprising:

a ceramic part; a metal part selected from the group consisting of titanium and titanium alloys; and a palladium (Pd) interface layer consisting of palladium that is combined with a portion of one or both of the metal part or the ceramic part to form a bond between said ceramic part and the metal part, and further comprising an electrode contact and a second palladium interface layer consisting of palladium, wherein the second interface layer bonds the electrode contact to the ceramic part of the component assembly housing.

2. The microstimulator of claim 1 , wherein the electrode contact and the metal part of the housing are electrically connected.

Assignments (2)
CHANGE OF NAME Recorded Dec 21, 2007
From: ADVANCED BIONICS CORPORATION
To: BOSTON SCIENTIFIC NEUROMODULATION CORPORATION
Reel/Frame 020296/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2006
From: HE, TOM XIAOHAI; COLVIN, MICHAEL S
To: ADVANCED BIONICS CORPORATION
Reel/Frame 017545/0668 →