Hermetically bonding ceramic and titanium with a Ti-Pd braze interface
View Patent ↗A component assembly for use in living tissue comprises: a ceramic part; a metal part; and a titanium palladium (Ti—Pd) interface layer for bonding said ceramic part to the metal part. In one embodiment, the interface layer may be formed from a single titanium layer in contact with a single palladium layer, or in other embodiments, may be at least a three layer laminate (Pd—Ti—Pd). A microstimulator housing comprising a ceramic part, a titanium or titanium alloy part sandwiching the Ti—Pd interlayer may be employed to create a eutectic bond that is strong and hermetic.
1. A component assembly for use in living tissue comprising:
a ceramic part;
a metal part selected from the group consisting of titanium and titanium alloys; and
an interface layer consisting essentially of titanium and palladium, the interface layer bonding the ceramic part to the metal part.
2. The component assembly of claim 1 , wherein said ceramic part is selected from the group consisting or zirconia, stabilized zirconia, partially stabilized zirconia, tetragonal zirconia, magnesia stabilized zirconia, ceria-stabilized zirconia, yttria-stabilized zirconia, and calcia-stabilized zirconia, as well as alumina, and titania.
3. The component assembly of claim 1 , wherein the interface layer forms a eutectic bond between said metal part and said ceramic part.
4. The component assembly of claim 1 , wherein the interface layer can be heated to a temperature that is at or greater than the eutectic melting point of the interface layer.
5. The component assembly of claim 1 , wherein the interface layer is a three-layer laminate comprising two palladium layers at least partially covering opposing sides of a titanium layer.
6. The component assembly of claim 5 , wherein the laminate is cold rolled to provide the intimate contact between layers.
7. The component assembly of claim 1 , wherein the interface layer is a two-layer laminate of comprising a titanium layer and a palladium layer.
8. The component assembly of claim 7 , wherein the laminate is cold rolled to provide intimate contact between layers.
9. The component assembly of claim 7 , wherein the laminate is formed by sputter coating palladium over titanium.
10. The component assembly of claim 7 , wherein the laminate is formed by vapor deposition of palladium over titanium.
11. A microstimulator comprising:
a component assembly housing comprising:
a ceramic part;
a metal part selected from the group consisting of titanium and titanium alloy; and
an interface layer consisting essentially of titanium and palladium, the interface layer bonding the ceramic part to the metal part.
12. The microstimulator of claim 11 , wherein said ceramic part is selected from the group consisting of zirconia, stabilized zirconia, partially stabilized zirconia, tetragonal zirconia, magnesia stabilized zirconia, ceria-stabilized zirconia, yttria-stabilized zirconia, and calcia-stabilized zirconia, as well as alumina, and titania.
13. The microstimulator of claim 11 , wherein the interface layer forms a eutectic bond between said metal part and said ceramic part.
14. The microstimulator of claim 11 , wherein the interface layer can be heated to a temperature that is at or greater than the eutectic melting point of the interface layer.
15. The microstimulator of claim 11 , wherein the interface layer is a three-layer laminate comprising two palladium layers at least partially covering opposing sides of a titanium layer.
16. The microstimulator of claim 15 , wherein the laminate is cold rolled to provide intimate contact between layers.
17. The microstimulator of claim 11 , wherein the interface layer is a two-layer laminate comprising a titanium layer and a palladium layer.
18. The microstimulator of claim 17 , wherein the laminate is cold rolled to provide intimate contact between layers.
19. The microstimulator of claim 17 , wherein the laminate is formed by sputter coating palladium over titanium.
20. The microstimulator of claim 17 , wherein the laminate is formed by vapor deposition of palladium over titanium.