Bonded components and component bonding
A method for bonding first and second components to one another comprises: forming a plurality of bonding area projections on a bonding area of a first component; depositing bonding metal on the bonding area of the first component or a corresponding bonding area of a second component; positioning the first and second components with the deposited bonding metal between their respective bonding areas and in contact therewith; and urging the first and second components toward one another, thereby pressing the deposited bonding metal therebetween. The plurality of bonding area projections protrude into the deposited bonding metal after the bonding metal is pressed between the first and second components. The first and second components are bonded to one another by each adhering to bonding metal. An apparatus comprises first and second components bonded according to the disclosed method.
1 . A method for bonding first and second components to one another, comprising:
forming a plurality of bonding area projections on a bonding area of the first component;
depositing bonding metal on the bonding area of the first component or on a corresponding bonding area of the second component;
positioning the first and second components with the deposited bonding metal between their respective bonding areas and in contact therewith; and
urging the first and second components toward one another, thereby pressing the deposited bonding metal therebetween,
wherein:
the plurality of bonding area projections protrude into the deposited bonding metal after the bonding metal is pressed between the first and second components; and
the first and second components are bonded to one another by each adhering to bonding metal.
2 . The method of claim 1 , wherein the respective bonding areas of the first and second components comprise conductive interconnection pads.
3 . The method of claim 1 , wherein:
the bonding metal is deposited on the bonding area of the first component after the plurality of bonding area projections is formed;
the plurality of bonding area projections protrude into the deposited bonding metal before the bonding metal is pressed between the first and second components; and
depositing the bonding metal on the bonding area of the first component results in a plurality of bonding metal projections protruding from the surface of the deposited bonding metal, the bonding metal projections being formed above the plurality of bonding area projections upon deposition of the bonding metal thereon.
4 . The method of claim 3 , wherein at least one bonding metal projection makes contact, when the bonding metal is pressed between the first and second components, with the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the bonding metal being pressed between the first and second components.
5 . The method of claim 3 , wherein:
bonding metal is also deposited on the bonding area of the second component; and
at least one bonding metal projection makes contact, when the bonding metal is pressed between the first and second components, with the bonding metal deposited on the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the bonding metal being pressed between the first and second components.
6 . The method of claim 1 , wherein the bonding metal is deposited on the bonding area of the second component, and the bonding area projections protrude into the bonding metal deposited on the bonding area of the second component after the bonding metal is pressed between the first and second components.
7 . The method of claim 1 , wherein the first and second components are urged toward one another with sufficient force so that upon release of the urging force the first and second components remain attached to one another by adhering to the deposited bonding metal without reflow of the bonding metal.
8 . The method of claim 1 , further comprising heating the bonding metal so that it reflows, wherein the plurality of bonding area projections continue to protrude into the bonding metal after reflow thereof.
9 . The method of claim 8 , wherein the first and second components are secured to one another by adhering to the reflowed bonding metal.
10 . The method of claim 9 , wherein the first and second components adhere to the bonding metal without the presence of flux during reflow of the bonding metal.
11 . The method of claim 1 , wherein the first or second component comprises an electronic component, an optical component, or an optoelectronic component.
12 . The method of claim 1 , wherein:
the first component comprises a planar optical waveguide substrate; and
the second component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate.
13 . The method of claim 1 , wherein:
the first component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate; and
the second component comprises a planar optical waveguide substrate.
14 . An apparatus, comprising:
a first component having a bonding area, the bonding area having a plurality of bonding area projections formed thereon;
a second component having a bonding area corresponding to the bonding area of the first component; and
bonding metal deposited on the bonding area of the first component or the bonding area of the second component,
wherein:
the first and second components are positioned with the deposited bonding metal between their respective bonding areas and in contact therewith, and with the plurality of bonding area projections protruding into the deposited bonding metal; and
the first and second components are bonded to one another by adhering to the deposited bonding metal.
15 . The apparatus of claim 14 , wherein the respective bonding areas of the first and second components comprise conductive interconnection pads.
16 . The apparatus of claim 14 , wherein:
the bonding metal is deposited on the bonding area of the first component over the plurality of bonding area projections; and
the deposited bonding metal comprises a plurality of bonding metal projections protruding from the surface thereof, the bonding metal projections being formed above the plurality of bonding area projections upon deposition of the bonding metal thereon.
17 . The apparatus of claim 16 , wherein at least one bonding metal projection makes contact with the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the contact.
18 . The apparatus of claim 16 , wherein:
bonding metal is also deposited on the bonding area of the second component; and
at least one bonding metal projection makes contact with the bonding metal deposited on the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the contact.
19 . The apparatus of claim 14 , wherein the bonding metal is deposited on the bonding area of the second component, and the bonding area projections protrude into the bonding metal deposited on the bonding area of the second component.
20 . The apparatus of claim 14 , wherein the first and second components are bonded to one another by adhering to the deposited bonding metal without reflow of the bonding metal.
21 . The apparatus of claim 14 , wherein the bonding metal has been reflowed, and the plurality of bonding area projections protrude into the reflowed bonding metal.
22 . The apparatus of claim 21 , wherein the first and second components are bonded to one another by adhering to the reflowed bonding metal.
23 . The apparatus of claim 22 , wherein the first and second components adhere to the bonding metal without the presence of flux during reflow of the bonding metal.
24 . The apparatus of claim 14 , wherein the first or second component comprises an electronic component, an optical component, or an optoelectronic component.
25 . The apparatus of claim 14 , wherein:
the first component comprises a planar optical waveguide substrate; and
the second component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate.
26 . The apparatus of claim 14 , wherein:
the first component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate; and
the second component comprises a planar optical waveguide substrate.
27 . A method for bonding first and second components to one another, comprising:
depositing bonding metal on a bonding area of the first component;
forming a plurality of bonding metal projections on the surface of the deposited bonding metal;
positioning the first component and the second component with the deposited bonding metal between respective bonding areas thereof; and
urging the first and second components toward one another, thereby pressing the deposited bonding metal therebetween,
wherein:
at least one bonding metal projection is deformed by the bonding metal being pressed between the first and second components; and
the first and second components are bonded to one another by each adhering to bonding metal.
28 . The method of claim 27 , wherein the respective bonding areas of the first and second components comprise conductive interconnection pads.
29 . The method of claim 27 , wherein at least one bonding metal projection makes contact, when the bonding metal is pressed between the first and second components, with the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the bonding metal being pressed between the first and second components.
30 . The method of claim 27 , wherein:
additional bonding metal is deposited on the bonding area of the second component; and
at least one bonding metal projection makes contact, when the bonding metal is pressed between the first and second components, with the additional bonding metal deposited on the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the bonding metal being pressed between the first and second components.
31 . The method of claim 27 , further comprising heating the bonding metal so that it reflows.
32 . The method of claim 31 , wherein the first and second components are bonded to one another by adhering to the reflowed bonding metal.
33 . The method of claim 32 , wherein the first and second components adhere to the bonding metal without the presence of flux during reflow of the bonding metal.
34 . The method of claim 27 , wherein the first or second component comprises an electronic component, an optical component, or an optoelectronic component.
35 . The method of claim 27 , wherein:
the first component comprises a planar optical waveguide substrate; and
the second component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate.
36 . The method of claim 27 , wherein:
the first component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate; and
the second component comprises a planar optical waveguide substrate.
37 . An apparatus, comprising:
a first component having a bonding area;
a second component having a bonding area corresponding to the bonding area of the first component; and
bonding metal deposited on the bonding area of the first component with a plurality of bonding metal projections formed thereon,
wherein:
the first and second components are positioned with the deposited bonding metal between their respective bonding areas and in contact therewith, thereby deforming at least one bonding metal projection; and
the first and second components are bonded to one another by each adhering to the deposited bonding metal.
38 . The apparatus of claim 37 , wherein the respective bonding areas of the first and second components comprise conductive interconnection pads.
39 . The apparatus of claim 37 , wherein at least one bonding metal projection makes contact with the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the bonding metal being pressed between the first and second components.
40 . The apparatus of claim 37 , wherein:
additional bonding metal is deposited on the bonding area of the second component; and
at least one bonding metal projection makes contact with the additional bonding metal deposited on the bonding area of the second component, and the bonding metal projection thus contacted is deformed by the bonding metal being pressed between the first and second components.
41 . The apparatus of claim 37 , wherein the first and second components are bonded to one another by adhering to the deposited bonding metal without reflow of the bonding metal.
42 . The apparatus of claim 37 , wherein the first or second component comprises an electronic component, an optical component, or an optoelectronic component.
43 . The apparatus of claim 37 , wherein:
the first component comprises a planar optical waveguide substrate; and
the second component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate.
44 . The apparatus of claim 37 , wherein:
the first component comprises a photodetector, an optical filter, a laser, an optical modulator, an optical amplifier, an optical reflector, an optical isolator, a lens, or a second planar optical waveguide substrate; and
the second component comprises a planar optical waveguide substrate.