Audio amplifier assembly
View Patent ↗An audio amplifier assembly that includes a semiconductor package having a semiconductor power die tuned for class D amplifier applications and a conductive clip used for low inductance integration into the amplifier circuit.
1. A power assembly comprising:
a package that includes:
a power semiconductor die having R DSON , Q g , Q sw , and Q rr tuned for class D audio amplification, said power semiconductor device including a first power electrode on one surface thereof, a second power electrode and a control electrode on another opposing surface thereof each readied for direct electrical and mechanical connection to a respective conductive pad; and
an electrically conductive clip having an interior surface electrically and mechanically attached to said first power electrode by a conductive adhesive and a connection surface readied for direct electrical and mechanical connection to a conductive pad, wherein said package is integrated with a class D audio amplifier circuit, whereby components for said class D audio amplifier circuit are operatively connected to said clip and said second power electrode of said die without wirebonds.
2. The power assembly of claim 1 , wherein said power semiconductor die a power MOSFET.
3. The power assembly of claim 1 , wherein said conductive adhesive is solder.
4. The power assembly of claim 3 , wherein said solder is lead free.
5. The power assembly of claim 1 , wherein said conductive adhesive is a conductive polymer.
6. The power assembly of claim 5 , wherein said conductive polymer is a conductive epoxy.
7. The power assembly of claim 1 , wherein said clip is a cup-shaped can.
8. The power assembly of claim 1 , wherein said clip includes a web portion, a surrounding rim portion spaced from said die, and at least one projection extending from said rim portion, wherein said projection includes said connection surface.
9. The power assembly of claim 1 , wherein said clip is comprised of copper.
10. The power assembly of claim 1 , wherein said clip is silver-plated.
11. The power assembly of claim 1 , wherein said clip is gold-plated.
12. The power assembly of claim 1 , further comprising a heat sink thermally coupled to said clip.
13. The power assembly of claim 1 , wherein said assembly does not include a heatsink.