Liquid phase fabrication of active devices including organic semiconductors

1. A process comprising the steps of:

providing a support body;

forming an organic semiconductor composition body including an organic semiconductor composition on said support body;

providing an organic dielectric composition mobilized in a liquid medium, said organic semiconductor composition being insoluble in said liquid medium; and

forming an organic dielectric composition body from said organic dielectric composition on said organic semiconductor composition body; wherein the organic semiconductor composition includes at least one member selected from a group consisting of:

5,5′-bis(4-(4-methylpentyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(3,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(3S,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-ethylbutyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-methylhexyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-ethylhexyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(1-methylhexyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-methylheptyl)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(1-methyihexyl)phenyl)-2,2′-bithiophene;

5,5′-Bis-[4-(1-ethyl-hexyloxy)-phenyl]-[2,2′]bithiophenyl;

5,5′-Bis-[4-(2-methyl-propoxy-tetrahydro-pyran)-phenoxy]-[2,2′]bithiophenyl;

3-(4-{5′-[4-(3-Hydroxy-2-methyl-propoxy)-phenyl]-[2,2′]bithiophenyl-5-yl}-phenoxy)-2-methyl-propan-1-ol;

5,5′-Bis-[4-(1-hydroxy-3-ethyl-heptyloxy)-phenyl]-[2,2′]bithiophenyl;

6-[4-(5′-{4-[5-(1-Vinyl-allyloxycarbonyl)-pentyloxy]-phenyl}-[2,2′]bithiophenyl-5-yl)-phenoxy]-hexanoic acid 1-vinyl-allyl ester;

5,5′-Bis-[4-N-(2-ethyl-hexyl)-benzamido]-[2,2′]bithiophenyl;

5,5′-Bis-{4-[6-(tert-butyl-diphenyl-silanyloxy)-hexyloxy]-phenyl}-[2,2′]bithiophenyl; and

5,5′-bis(4-(propoxy ethyl)phenyl)-2,2′-bithiophene.

2. A process comprising the steps of:

providing a support body;

forming an organic dielectric composition body on said support body;

providing an organic semiconductor composition mobilized in a liquid medium, the organic dielectric composition body being insoluble in said liquid medium; and

forming an organic semiconductor composition body including said organic semiconductor composition on said organic dielectric composition body; wherein the organic semiconductor composition includes at least one member selected from a group consisting of:

5,5′-bis(4-(4-methylpentyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(3,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(3S,7-dimethyloctyloxyl)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-ethylbutyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-methylhexyoxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-ethylhexyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(1-methylhexyloxy)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(2-methylheptyl)phenyl)-2,2′-bithiophene;

5,5′-bis(4-(1-methylhexyl)phenyl)-2,2′-bithiophene;

5,5′-Bis-[4-(1-ethyl-hexyloxy)-phenyl]-[2,2′]bithiophenyl;

5,5′-Bis-[4-(2-methyl-propoxy-tetrahydro-pyran)-phenoxy]-[2,2′]bithiophenyl;

3-(4-{5′-[4-(3-Hydroxy-2-methyl-propoxy)-phenyl]-[2,2′]bithiophenyl-5-yl}-phenoxy)-2-methyl-propan-1-ol;

5,5′-Bis-[4-(1-hydroxy-3-ethyl-heptyloxy)-phenyl]-[2,2′]bithiophenyl;

6-[4-(5′-{4-[5-(1-Vinyl-allyloxvcarbonyl)-pentyloxy]-phenyl}-[2,2′]bithiophenyl-5-yl)-phenoxy]-hexanoic acid 1-vinyl-allyl ester;

5,5′-Bis-[4-N-(2-ethyl-hexyl)-benzamido]-[2,2′]bithiophenyl;

5,5′-Bis-{4-[6-(tert-butyl-diphenyl-silanyloxy)-hexyloxy]-phenyl}-[2,2′]bithiophenyl; and

5,5′-bis(4-(propoxy ethyl)phenyl)-2,2′-bithiophene.

3. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(4-methylpentyloxy)phenyl)-2,2′-bithiophene.

4. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(1-methylhexyloxy)phenyl)-2,2′-bithiophene.

5. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(propoxy ethyl)phenyl)-2,2′-bithiophene.

6. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(3,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene; or 5,5′-bis(4-(3S,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene; or their mixture.

7. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(2-ethylbutyloxy)phenyl)-2,2′-bithiophene; or 5,5′-bis(4-(2-methylhexyloxy)phenyl)-2,2′-bithiophene; or their mixture.

8. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(2-ethylhexyloxy)phenyl)-2,2′-bithiophene; or 5,5′-bis(4-(2-methylheptyl) phenyl)-2,2′-bithiophene; or their mixture.

9. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-bis(4-(1-methylhexyl)phenyl)-2,2′-bithiophene; or 5,5′-Bis-[4-(1-ethyl-hexyloxy)-phenyl]-[2,2′]bithiophenyl; or their mixture.

10. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-Bis-[4-(2-methyl-propoxy-tetrahydro-pyran)-phenoxy]-[2,2′]bithiophenyl; or 3-(4-{5′-[4-(3-Hydroxy-2-methyl-propoxy)-phenyl]-[2,2′]bithiophenyl-5-yl}-phenoxy)-2-methyl-propan-1-ol; or their mixture.

11. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-Bis-[4-(1-hydroxy-3-ethyl-heptyloxy)-phenyl]-[2,2′]bithiophenyl; or 6-[4-(5′-{4-[5-(1-Vinyl-allyloxycarbonyl)-pentyloxy]-phenyl}-[2,2′]bithiophenyl-5-yl)-phenoxy]-hexanoic acid 1-vinyl-allyl ester; or their mixture.

12. The process of claim 1 , wherein the organic semiconductor composition includes 5,5′-Bis-[4-N-(2-ethyl-hexyl)-benzamido]-[2,2′]bithiophenyl; or 5,5′-Bis-{4-[6-(tert-butyl-diphenyl-silanyloxy)-hexyloxy]-phenyl}-[2,2′]bithiophenyl; or their mixture.

13. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(4-methylpentyloxy)phenyl)-2,2′-bithiophene.

14. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(1-methylhexyloxy)phenyl)-2,2′-bithiophene.

15. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(propoxy ethyl)phenyl)-2,2′-bithiophene.

16. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(3,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene; or 5,5′-bis(4-(3S,7-dimethyloctyloxy)phenyl)-2,2′-bithiophene; or their mixture.

17. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(2-ethylbutyloxy)phenyl)-2,2′-bithiophene; or 5,5′-bis(4-(2-methylhexyloxy)phenyl)-2,2′-bithiophene; or their mixture.

18. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(2-ethylhexyloxy)phenyl)-2,2′-bithiophene; or 5,5′-bis(4-(2-methylheptyl) phenyl)-2,2′-bithiophene; or their mixture.

19. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-bis(4-(1-methyihexyl)phenyl)-2,2′-bithiophene; or 5,5′-Bis-[4-(1-ethyl-hexyloxy) -phenyl]-[2,2′]bithiophenyl; or their mixture.

20. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-Bis-[4-(2-methyl-propoxy-tetrahydro-pyran)-phenoxy]-[2,2′]bithiophenyl; or 3-(4-{5′-[4-(3-Hydroxy-2-methyl-propoxy)-phenyl]-[2,2′]bithiophenyl-5-yl}-phenoxy)-2-methyl-propan-1-ol; or their mixture.

21. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-Bis-[4-(1-hydroxy-3-ethyl-heptyloxy)-phenyl]-[2,2′]bithiophenyl; or 6-[4-(5 ′-{4-[5-(1-Vinyl-allyloxycarbonyl)-pentyloxy]-phenyl}-[2,2′]bithiophenyl-5-yl)-phenoxy]-hexanoic acid 1-vinyl-allyl ester; or their mixture.

22. The process of claim 2 , wherein the organic semiconductor composition includes 5,5′-Bis-[4-N-(2-ethyl-hexyl)-benzamido]-[2,2′]bithiophenyl; or 5,5′-Bis-{4-[6-(tert-butyl-diphenyl-silanyloxy)-hexyloxy]-phenyl}-[2,2′]bithiophenyl; or their mixture.