Flip chip system with organic/inorganic hybrid underfill composition
View Patent ↗A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.
1. A packaging system, comprising:
a flip chip on a mounting substrate;
an underfill mixture between the flip chip and the mounting substrate, wherein the underfill mixture includes a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) and a tetrafunctional, low viscosity TGMX epoxy resin.
2. A packaging system according to claim 1 , wherein the underfill mixture includes nano-alumina powder in a range from about 5-15 weight %.
3. A packaging system according to claim 1 , wherein the underfill mixture includes trimethoxy(aminopropyl) silane in a range of about 1-3 mole %.
4. A chip package, comprising:
a chip including an active surface;
a mounting substrate including an upper surface that faces the active surface;
electrical coupling between the active surface and upper surface; and
an underfill mixture between the upper surface and the active surface, wherein the underfill mixture includes a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) and a tetrafunctional, low viscosity TGMX epoxy resin.
5. A chip package according to claim 4 , wherein the underfill mixture includes nano-alumina powder in a range from about 5-15 weight %.
6. A chip package according to claim 4 , wherein the underfill mixture includes trimethoxy(aminopropyl) silane in a range of about 1-3 mole %.