Multi-level semiconductor module and method for fabricating the same
A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3 . The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.
1. A multi-level semiconductor module formed by alternately stacking resin boards and sheet members, each of the resin boards including one or more first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including one or more second buried conductors electrically connected to the first buried conductors, wherein one of the resin boards located at the bottom has a thickness larger than that of each of the other resin board or boards,
the semiconductor chip provided with a semiconductor memory is mounted on each of the resin board or boards except for the resin board located at the bottom, and
the semiconductor chip mounted on the resin board at the bottom is provided with a controlling semiconductor device for controlling the semiconductor memory.
2. The multi-level semiconductor module of claim 1 , wherein each of the sheet members includes a resin base and the second buried conductors provided around the opening, and
the resin base has a thickness larger than that of the semiconductor chip.
3. The multi-level semiconductor module of claim 1 , wherein the first buried conductors are formed through each of the resin boards, and
the second buried conductors connected to the first buried conductors project from upper and back faces of the resin base.
4. The multi-level semiconductor module of claim 1 , wherein a plurality of external connection terminals for connection to external equipment are formed on a back face of the resin board located at the bottom.
5. The multi-level semiconductor module of claim 1 , wherein out of the resin boards, at least one of the resin board located at the bottom and the resin board located at the top has a thickness larger than that of each of the semiconductor chip or chips mounted on the other resin board or boards.
6. The multi-level semiconductor module of claim 1 , further includes a rigid plate having a thermal conductivity higher than that of the resin boards, the rigid plate being located over one of the resin boards located at the top.
7. A multi-level semiconductor module formed by alternately stacking resin boards and sheet members, each of the resin boards including one or more first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including one or more second buried conductors electrically connected to the first buried conductors, wherein one of the resin boards located at the bottom has a thickness larger than that of each of the ether resin board or boards, and
each of the first buried conductors in the resin board or boards except for the resin boards located at the bottom and the top has a diameter larger than that of each of the first buried conductors in the resin boards located at the bottom and the top.
8. The multi-level semiconductor module of claim 7 , wherein each of the second buried conductors in the sheet member or members except for the sheet members in contact with the resin boards located at the bottom and the top has a diameter larger than that of each of the second buried conductors in the sheet members in contact with the resin boards located at the bottom and the top.
9. The multi-level semiconductor module of claim 1 , wherein one or more electrode bumps are provided on a principal surface of the semiconductor chip, and
each of the resin boards further includes: one or more connection terminals bonded to the electrode bumps; and one or more wires connecting the connection terminals to the first buried conductors.
10. The multi-level semiconductor module of claim 9 , wherein the electrode bumps are provided on a center region of the semiconductor chip, and
the wires are provided on each of an upper face and a back face of each of the resin boards.
11. A multi-level semiconductor module formed by alternately stacking resin boards and sheet members, each of the resin boards including one or more first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including one or more second buried conductors electrically connected to the first buried conductors, wherein one of the resin boards located at the bottom has a thickness larger than that of each of the other resin board or boards,
one or more electrode bumps are provided on a principal surface of the semiconductor chip,
each of the resin boards further includes: one or more connection terminals bonded to the electrode bumps; and one or more wires connecting the connection terminals to the first buried conductors,
the electrode bumps are provided on a center region of the semiconductor chip,
the wires are provided on each of an upper face and a back face of each of the resin boards,
the semiconductor chip further includes projections having an identical height and located at both ends of the principal surface, and
each of the resin boards further includes one or more dummy electrodes in contact with the projections.
12. A multi-level semiconductor module formed by alternately stacking resin boards and sheet members, each of the resin boards including one or more first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including one or more second buried conductors electrically connected to the first buried conductors, wherein one of the resin boards located at the bottom has a thickness larger than that of each of the other resin board or boards,
one or more electrode bumps are provided on a principal surface of the semiconductor chip,
each of the resin boards further includes: one or more connection terminals bonded to the electrode bumps; and one or more wires connecting the connection terminals to the first buried conductors, and
each of one or more of the first buried conductors connected to the electrode bumps has a diameter larger than that of each of the other first buried conductor or conductors.
13. A multi-level semiconductor module formed by alternately stacking resin boards and sheet members, each of the resin boards including one or more first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including one or more second buried conductors electrically connected to the first buried conductors, wherein one of the resin boards located at the bottom has a thickness larger than that of each of the other resin board or boards, and
the resin base forming each of the resin boards is made of a mixture containing 70 wt % to 95 wt %, both inclusive, of an inorganic filler and a thermosetting resin.