IP Library Granted Patent US 7,554,177
Granted Patent B2
US 7,554,177 · App. 11/243,569 · Granted Jun 30, 2009

Attachment system incorporating a recess in a structure

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Quick Facts
Patent No.
US 7,554,177
App. No.
11/243,569
Granted
Jun 30, 2009
Kind
B2
Abstract

An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

Claims (20)

1. An attachment system, comprising:

a first substrate having a surface and a recess, the recess extending from an opening in the surface and terminating in a cavity located inside the first substrate, the opening comprising a first rectangular portion that is intersected by a second rectangular portion;

a polymer structure with a first portion molded into the recess and the cavity of the first substrate, and a second portion extending above the surface of the first structure, wherein the first portion contained inside the recess and the cavity is operative to anchor the polymer structure to the first substrate, the polymer structure characterized by a glass transition temperature that defines a transition of the polymer from a deformable state to a rigid state during attachment of the polymer structure to the first substrate; and

a second substrate and a second substrate having a surface and a recess, wherein a third portion of the polymer structure is molded into the recess of the second substrate, thereby anchoring the polymer structure to the second substrate.

2. The attachment system as recited in claim 1 , wherein the first substrate is a semiconductor substrate.

3. The attachment system as recited in claim 1 , wherein the material of the first substrate is selected from the group consisting of silicon, gallium arsenide (GaAs), other III-V materials, glass, quartz, and ceramic.

4. The attachment system as recited in claim 1 , wherein the recess in the first substrate further comprises a neck extending from the opening at the surface of the first substrate to the cavity located inside the first structure, and further wherein the cavity has a substantially circular cross-section.

5. The attachment system as recited in claim 1 , wherein the opening further comprises a third rectangular portion that intersects the first rectangular portion.

6. The attachment system as recited in claim 1 , wherein the first rectangular portion is configured as a longitudinal channel in the first substrate with the second rectangular portion orthogonally intersecting the longitudinal channel.

7. An attachment system comprising:

a first substrate that includes a recess originating from an opening in a surface of the first substrate, the recess comprising a first recess portion located below the surface, the first recess portion having a first width that is greater than a second width corresponding to the opening in the surface;

a polymer structure comprising a material characterized by a glass transition temperature that defines a transition of the material from a deformable state at to a rigid state, the material occupying at least a portion of the recess in the first substrate thereby anchoring the polymer structure to the first substrate; and

a second substrate that includes a recess, wherein the polymer structure is further molded into at least a portion of the recess in the second substrate, thereby anchoring the polymer structure to the second substrate as well.

8. The attachment system as recited in claim 7 , wherein the first recess portion has a circular cross-section as viewed parallel to the surface of the first substrate, and wherein the first width corresponds to a diameter of the circular cross-section.

9. The attachment system as recited in claim 7 , wherein the first recess portion is part of a curved sidewall of the recess.

10. The attachment system as recited in claim 7 , wherein the recess in the first substrate has a teardrop profile.

11. The attachment system as recited in claim 7 , wherein the opening is configured as a rectangular opening.

12. The attachment system as recited in claim 11 , wherein the rectangular opening is further configured as a longitudinal channel in the first substrate.

13. The attachment system as recited in claim 7 , wherein the opening comprises a first rectangular portion that is intersected by a second rectangular portion.

14. The attachment system as recited in claim 13 , wherein the first rectangular portion is configured as a longitudinal channel in the first substrate, and wherein the longitudinal channel is intersected by the second rectangular portion.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED AT REEL: 047195 FRAME: 0827. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Nov 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047924/0571 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0827 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2005
From: GEEFAY, FRANK S.; DUTTON, DAVID T.; BAI, QING
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 016720/0979 →