IP Library Patent Application 11243717
Patent Application Utility Small
App. No. 11/243,717 · Confirmation No. 9249

Apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure

Inventor: Kuo-Ching Liu
Expressly Abandoned -- During Examination View Publication ↗
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2006-08-29 PGEA.G Petition for PreGrant Publication Express Abandonment - Granted 1 View
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2006-05-22 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2006-05-22 FOR Foreign Reference 10 View
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2006-05-22 N417 Electronic Filing System Acknowledgment Receipt 3 View
2005-10-05 TRNA Transmittal of New Application 1 View
2005-10-05 SPEC Specification 15 View
2005-10-05 CLM Claims 5 View
2005-10-05 ABST Abstract 1 View
2005-10-05 DRW Drawings-only black and white line drawings 8 View
2005-10-05 OATH Oath or Declaration filed 2 View
2005-10-05 WFEE Fee Worksheet (SB06) 1 View
2005-10-05 WFEE Fee Worksheet (SB06) 1 View
2005-10-05 ADS Application Data Sheet 5 View
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Quick Facts
App. No.
11/243,717
Filed
2005-10-05
Pub. No.
US20060027886A1
Examiner
HUYNH, ANDY
Art Unit
2818