Methods and apparatuses relating to findable balls
View Patent ↗Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.
1. A portion of a golf ball, the portion comprising:
a core material having a void;
a semiconductor component disposed at least partially in the void;
a filler material in the void and surrounding the semiconductor component, the filler material being capable of transforming from a liquid state having a first volume into a solid state which occupies substantially the first volume within the void and wherein the filler material and the core material are different materials;
at least one elastic conductive antenna attached to the core material and coupled to the semiconductor component, and wherein the semiconductor component is one of a diode or transistor or a Radio Frequency Identification integrated circuit and wherein the at least one elastic conductive antenna is configured to transmit an RF signal through the air.
2. A portion of a golf ball as in claim l wherein a difference in volume between the liquid state and the solid state is less than about 0.2% of the liquid state.
3. A portion as in claim l wherein the filler material cures without evaporating a solvent.
4. A portion as in claim 1 wherein the filler material cures by a chemical reaction between components in the filler material, and wherein the filler material and the semiconductor component occupy substantially all space in the void, and wherein the filler material changes from the liquid state to the solid state without any significant shrinkage or expansion.
5. A portion as in claim 1 further comprising:
a sealant encasing the elastic conductive antenna and the semiconductor component; and
a shell material which encapsulates the sealant and wherein the void is on an outer surface of the core material.
6. A golf ball comprising:
a golf ball material having a void at a surface of the golf ball material;
an antenna disposed on the surface of the golf ball material, the antenna being configured to transmit a Radio Frequency signal through the air;
a semiconductor component disposed at least partially in the void;
a filler material in the void and surrounding the semiconductor component on at least two sides of the semiconductor component and wherein the surface of the golf ball material defines an upper edge of the void which is substantially planar with an upper surface of the filler material and an upper edge of the semiconductor component and wherein the filler material and the golf ball material are different materials.
7. A golf ball as in claim 6 wherein the filler material surrounds the semiconductor component on four side surfaces and on a bottom surface of the semiconductor component.
8. A golf ball as in claim 7 wherein the antenna is an elastic conductive antenna attached to the golf ball material and coupled to the semiconductor component and further comprising a sealant which encases the semiconductor component and the elastic conductive antenna and wherein the filler material is applied into the void as a liquid.
9. A golf ball as in claim 7 wherein an upper surface of the filler material and the surface of the golf ball material provide a relatively smooth surface to support the antenna and wherein a precise amount of filler material is applied into the void.
10. A golf ball comprising:
a golf ball material having a void at a surface of the golf ball material;
a filler material disposed in the void;
a semiconductor component disposed at least partially in the void, wherein an electrical connection surface of the semiconductor component faces the golf ball material at a side of the void and wherein the surface of the golf ball material defines an upper edge of the void which is substantially planar with an upper surface of the filler material and an upper edge of the semiconductor component.
11. A golf ball as in claim 10 further comprising:
an antenna disposed on the surface of the golf ball material and at least partially on the side of the void and being coupled to the electrical connection surface.
12. A golf ball as in claim 11 wherein the side of the void is a bottom surface of the void.
13. A portion of a golf ball comprising:
a core material having a void;
an antenna coupled to the core material;
a filler material disposed in the void;
a semiconductor component coupled to the antenna;
a sealant encasing the antenna and the semiconductor component and the core material, wherein the sealant is applied before applying a shell material, and wherein the sealant prevents the core material from being exposed to air and moisture before the shell material is applied and wherein the antenna comprises an elastic conductive material and wherein the semiconductor component is disposed in the void in a surface of the core material and wherein the filler material and the core material are different materials.