Reducing thermal expansion effects in semiconductor packages
View Patent ↗Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.
1. An electronic device comprising:
a support;
an electronic component supported by the support;
a first layer substantially encasing, and in direct physical contact with, all exposed surfaces of the electronic component; and
a second layer substantially encasing, and in direct physical contact with, all exposed surfaces of the first layer, the second layer also substantially encasing, and in direct physical contact with, all exposed surfaces of that portion of the support that is supporting the electronic component,
wherein the first layer comprises a first material that does not have any filler particles embedded therein and that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature, the second layer comprises a second material having filler particles embedded therein, the filler particles have different thermal expansion characteristics than the first material for reducing overall expansion of the second layer in response to increase in temperature, the filler particles have a modulus of elasticity that is different from the first material, and the filler particles cause scattering of an optical signal transmitted through the second layer.
2. An electronic device according to claim 1 , further comprising:
electrical leads electrically coupled to the electronic component and at least partially encased by the first layer to create a mechanical buffer between the electrical leads such that the electrical leads are protected from thermal expansion of the second layer caused by changes in temperature; and
a ceramic piece mounted between the support and the electronic component.
3. An electronic device according to claim 1 , the electronic component further comprising:
an oxide channel for producing an optical emission.
4. An electronic device according to claim 1 , wherein the support is a leadframe or a substrate, and wherein the electronic component is one of: an optical receiver, an optical transmitter, a laser, a vertical cavity surface emitting laser (VCSEL), a sensor, a capacitor, a photodiode, or a silicon chip.
5. An electronic device according to claim 4 , wherein:
the electronic component is a VCSEL and the support is a leadframe;
the VCSEL is die attached to a top surface of the leadframe that is directly opposite from and substantially parallel to a bottom surface of the leadframe; and
the second layer substantially encases, and is in direct physical contact with, the portion of the bottom surface of the leadframe that is directly opposite from the VCSEL.
6. An electronic device according to claim 5 , wherein the second layer substantially encases, and is in direct physical contact with, all of the bottom surface of the leadframe that is directly opposite from a portion of the top surface of the leadframe that is covered by the first layer.
7. An electronic device according to claim 1 , wherein the first material comprises silicone.
8. An electronic device according to claim 1 , wherein the first material comprises an elastomer material and the second material comprises a plastic material.
9. An electronic device according to claim 1 , wherein the filler material is glass and the rest of the second layer is a B-staged epoxy.
10. An electronic device according to claim 1 , wherein the first layer comprises a dye for visually accentuating cracks in the electronic device, wherein the dye is at least partially translucent allowing for optical communication of optical signals through the first layer with the electronic component.
11. An electronic device according to claim 10 , wherein the first layer has a refractive index of about 1.4 and the second layer has a refractive index of about 1.55.
12. An electronic device according to claim 1 , wherein the electronic component is an optical transmitter, the first layer and second layer are at least partially transparent allowing for transmission of an optical emission from the optical transmitter through the first and second layers, and wherein the first layer has a lower index of refraction than the second layer.
13. An electronic device according to claim 1 , wherein the second material comprises plastic so as to protect the electronic component from different environments including both dry and humid environments.
14. An electronic device according to claim 1 , wherein the second layer is produced by an injection molding process, a transfer molding process, or a pour molding process.