Printer controller apparatus implemented as a system in a package
A printer device includes a printer engine controller in communication with a print mechanism and a printer formatter. The printer formatter includes a quad flat pack (QFP) package having an application specific integrated circuit (ASIC) mounted and a memory device mounted therein. The printer device further includes a substrate having the QFP package and the printer engine controller mounted thereon.
1 . A printer formatter device, comprising:
a quad flat pack (QFP) package;
an application specific integrated circuit (ASIC) mounted within the QFP package; and
a memory device mounted within the QFP package.
2 . The printer formatter device of claim 1 , wherein the QFP package further comprises a lead frame and a die paddle forming a part of the lead frame, the memory device mounted to said die paddle, and further comprising:
a plurality of bond wires connecting the ASIC and the memory device to the QFP package.
3 . The printer formatter device of claim 1 , wherein the ASIC and the memory device each comprise discrete chips.
4 . The printer formatter device of claim 3 , wherein the ASIC comprises a microprocessor element.
5 . The printer formatter device of claim 3 wherein the memory device comprises a DRAM.
6 . The printer formatter device of claim 5 , wherein the DRAM further comprises a known good die (KGD).
7 . A printer device, comprising:
a printer engine controller;
a print mechanism in communication with the printer engine controller;
a printer formatter also in communication with printer engine controller, the printer formatter comprising,
a quad flat pack (QFP) package,
an application specific integrated circuit (ASIC) mounted within the QFP package, and
a memory device mounted within the QFP package; and
a substrate having the QFP package and the printer engine controller mounted thereon.
8 . The printer device of claim 7 , wherein the substrate comprises phenolic paper.
9 . The printer device of claim 8 , wherein said phenolic paper further comprises FR1.
10 . The printer device of claim 7 , wherein the QFP package further comprises a lead frame and a die paddle forming a part of the lead frame, the memory device mounted to said die paddle, and further comprising:
a plurality of bond wires connecting the ASIC and the memory device to the QFP package.
11 . The printer device of claim 7 , wherein the ASIC and the memory device each comprise discrete chips.
12 . The printer device of claim 11 , wherein the ASIC comprises a microprocessor element.
13 . The printer device of claim 11 wherein the memory device comprises a DRAM.
14 . The printer device of claim 13 , wherein the DRAM further comprises a known good die (KGD).