IP Library Granted Patent US 7,675,390
Granted Patent B2
US 7,675,390 · App. 11/253,851 · Granted Mar 9, 2010

Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator

Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 7,675,390
App. No.
11/253,851
Granted
Mar 9, 2010
Kind
B2
Abstract

Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and an electrically-isolating acoustic coupler connected between the modulator and the demodulator. The acoustic coupler comprises no more than one decoupled stacked bulk acoustic resonator (DSBAR). An electrically-isolating acoustic coupler based on a single DSBAR is physically small and is inexpensive to fabricate yet is capable of passing information signals having data rates in excess of 100 Mbit/s and has a substantial breakdown voltage between its inputs and its outputs.

Claims (42)

1. An acoustic galvanic isolator, comprising:

a carrier signal source;

a modulator connected to receive an information signal and the carrier signal;

a demodulator; and

connected between the modulator and the demodulator, an electrically-isolating acoustic coupler comprising exactly one decoupled stacked bulk acoustic resonator (DSBAR),

wherein the DSBAR comprises a first film bulk acoustic resonator (FBAR), a second FBAR, and an electrically-insulating acoustic decoupler between the FBARs, and

wherein the electrically-insulating acoustic decoupler comprises at least one of: (1) an electrically-insulating acoustic Bragg structure; (2) a quarter-wave thick layer of acoustic coupling material; and (3) at least one layer of crosslinked polyphenylene polymer.

2. The acoustic galvanic isolator of claim 1 , additionally comprising:

a first electrical circuit electrically connecting the modulator to the first FBAR; and

a second electrical circuit electrically connecting the demodulator to the second FBAR.

3. The acoustic galvanic isolator of claim 2 , in which:

each FBAR comprises opposed planar electrodes and a piezoelectric element between the electrodes;

the first electrical circuit electrically connects the modulator to the electrodes of the first FBAR; and

the second electrical circuit electrically connects demodulator to the electrodes of the second FBAR.

4. The acoustic galvanic isolator of claim 1 , wherein the electrically-insulating acoustic decoupled comprises the electrically-insulating acoustic Bragg structure, and wherein the electrically-insulating acoustic Bragg structure comprises first, second, and third Bragg elements, the second Bragg element being disposed in between the first and third Bragg elements and having a lower acoustic impedance than the first and third Bragg elements, respectively, at least one of the Bragg elements comprising a layer of electrically-insulating material.

5. The acoustic galvanic isolator of claim 4 , wherein the first Bragg element is a quarter-wave thick layer of a same material as an electrode of the first FBAR, and the third Bragg element is a quarter-wave thick layer of a same material as an electrode of the second FBAR.

6. The acoustic galvanic isolator of claim 1 , wherein the electrically-insulating acoustic decoupler comprises the electrically-insulating acoustic Bragg structure, and wherein the electrically-insulating acoustic Bragg structure comprises one or more layers of crosslinked polyphenylene polymer interleaved with layers of silicon dioxide.

7. The acoustic galvanic isolator of claim 1 , wherein the electrically-insulating acoustic decoupler comprises the quarter-wave thick layer of acoustic coupling material.

8. The acoustic galvanic isolator of claim 1 , wherein the electrically-insulating acoustic decoupler comprises the at least one layer of crosslinked polyphenylene polymer.

9. A method for galvanically isolating an information signal, the method comprising:

providing an electrically-isolating acoustic coupler comprising exactly one decoupled stacked bulk acoustic resonator (DSBAR), the DSBAR comprising a first film bulk acoustic resonator (FBAR), a second FBAR, and an electrically-insulating acoustic decoupler between the FBARs, wherein the electrically-insulating acoustic decoupler comprises at least one of: (1) an electrically-insulating acoustic Bragg structure; (2) a quarter-wave thick layer of acoustic coupling material; and (3) at least one layer of crosslinked polyphenylene polymer;

providing a carrier signal;

modulating the carrier signal with the information signal to form a modulated electrical signal;

acoustically coupling the modulated electrical signal through the electrically-isolating acoustic coupler; and

recovering the information signal from the modulated electrical signal acoustically coupled through the electrically-isolating acoustic coupler.

10. The method of claim 9 , in which the recovering comprises performing clock and data recovery on the modulated electrical signal acoustically coupled through the electrically-isolating acoustic coupler.

11. The method of claim 9 , wherein the electrically-insulating acoustic decoupler comprises the electrically-insulating acoustic Bragg structure, and wherein the electrically-insulating acoustic Bragg structure comprises first, second, and third Bragg elements, the second Bragg element being disposed in between the first and third Bragg elements and having a lower acoustic impedance than the first and third Bragg elements, respectively, at least one of the Bragg elements comprising a layer of electrically-insulating material.

12. The method of claim 11 , wherein the first Bragg element is a quarter-wave thick layer of a same material as an electrode of the first FBAR, and the third Bragg element is a quarter-wave thick layer of a same material as an electrode of the second FBAR.

13. The method of claim 9 , wherein the electrically-insulating acoustic decoupler comprises the quarter-wave thick layer of acoustic coupling material.

14. The method of claim 9 , wherein the electrically-insulating acoustic decoupler comprises the at least one layer of crosslinked polyphenylene polymer.

15. An acoustic galvanic isolator, comprising:

a semiconductor substrate having an insulating layer formed on a top surface thereof;

a carrier signal source disposed on the substrate;

a modulator disposed on the substrate and connected to receive an information signal and the carrier signal and to modulate the information signal onto the carrier signal to produce a modulated signal;

a demodulator disposed on the substrate; and

an electrically-isolating acoustic coupler disposed on the substrate and connected between the modulator and the demodulator, the electrically-isolating acoustic coupler comprising exactly one decoupled stacked bulk acoustic resonator (DSBAR),

wherein the demodulator is adapted to receive the modulated signal from the electrically-isolating acoustic coupler and in response thereto outputs the information signal.

16. The acoustic galvanic isolator of claim 15 , wherein the DSBAR comprises a first film bulk acoustic resonator (FBAR), a second FBAR, and an electrically-insulating acoustic decoupler between the FBARs the electrically-insulating acoustic decoupler comprises at least one of: (1) an electrically-insulating acoustic Bragg structure; (2) a quarter-wave thick layer of acoustic coupling material; and (3) at least one layer of crosslinked polyphenylene polymer.

17. The acoustic galvanic isolator of claim 16 , wherein the electrically-insulating acoustic decoupler comprises the quarter-wave thick layer of acoustic coupling material.

18. The acoustic galvanic isolator of claim 16 , wherein the electrically-insulating acoustic decoupler comprises the at least one layer of crosslinked polyphenylene polymer.

19. The acoustic galvanic isolator of claim 16 , wherein the electrically-insulating acoustic decoupler comprises the electrically-insulating acoustic Bragg structure, and wherein the electrically-insulating acoustic Bragg structure comprises first, second, and third Bragg elements, the second Bragg element being disposed in between the first and third Bragg elements and having a lower acoustic impedance than the first and third Bragg elements, respectively, at least one of the Bragg elements comprising a layer of electrically-insulating material.

20. The acoustic galvanic isolator of claim 19 , wherein the first Bragg element is a quarter-wave thick layer of a same material as an electrode of the first FBAR, and the third Bragg element is a quarter-wave thick layer of a same material as an electrode of the second FBAR.

Assignments (11)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED AT REEL: 047195 FRAME: 0827. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Nov 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047924/0571 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0827 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0434 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2006
From: LARSON, III, JOHN D
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 017132/0908 →
Continuity (1)
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