IP Library Granted Patent US 7,159,971
Granted Patent B2
US 7,159,971 · App. 11/255,104 · Granted Jan 9, 2007

Multi-nozzle ink jet head

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Quick Facts
Patent No.
US 7,159,971
App. No.
11/255,104
Granted
Jan 9, 2007
Kind
B2
Abstract

A multi-nozzle ink jet head formed through semiconductor processes. The multi-nozzle head has a head substrate in which are formed a plurality of nozzles and a plurality of pressure chambers, a diaphragm that acts as a common electrode and covers the plurality of pressure chambers, piezoelectric body layers that are provided in correspondence with the pressure chambers on the diaphragm, and individual electrode layers that are provided on the piezoelectric body layers and have individual electrode parts corresponding to the pressure chambers and wiring parts for the individual electrode parts. By interposing a low-dielectric-constant layer or an insulating layer in the region of the wiring parts, or not disposing the common electrode in the region of the wiring parts, the electrical capacitance of the driving parts is reduced, and hence a driving lag is prevented from occurring, and moreover unwanted vibration of the piezoelectric bodies is prevented.

Claims (7)

1. A multi-nozzle ink jet head having a plurality of nozzles that eject ink, comprising:

a head substrate in which are formed said plurality of nozzles and a plurality of pressure chambers;

a diaphragm that functions as a common electrode and covers said plurality of pressure chambers;

piezoelectric body layers that are provided in correspondence with said pressure chambers on said diaphragm; and

individual electrode layers that are provided on said piezoelectric body layers and have individual electrode parts corresponding to said pressure chambers and wiring parts of said individual electrode parts;

wherein said diaphragm has a laminated structure including a common electrode layer provided only in a region other than a region of said wiring parts, and a rigid layer.

2. The multi-nozzle ink jet head according to claim 1 , wherein said rigid layer is provided in the regions of both said wiring parts and said individual electrode parts.