Magneto-hydrodynamic hot spot cooling heat sink
A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at least a portion of each of the first pipe and the second pipe is arranged to be disposed vertically over the hot spot. An assembly connected to the first pipe and the second pipe is arranged to generate a magnetic field and induce electrical current flow through the magnetic field. A flow of thermally and electrically conductive fluid in the first pipe and a flow of the fluid in the second pipe are dependent on the electrical current flow and the magnetic field.
1. A heat sink, comprising:
an electrically and thermally conductive fluid;
a first pipe disposed interior to and concentric with a second pipe, wherein at least a portion of a first end of the first pipe and at least a portion of a first end of the second pipe are disposed vertically over a hot spot; and
an assembly configured to generate a magnetic field and to induce an electrical current, wherein the electrical current flows through the magnetic field to propagate the electrically and thermally conductive fluid through the first pipe and the second pipe outside of the first pipe,
wherein a direction of fluid flow in the first pipe and a direction of fluid flow in the second pipe are dependent on the magnetic field and the electrical current.
2. The heat sink of claim 1 , further comprising:
a shield configured to at least partially shield the magnetic field.
3. The heat sink of claim 1 , wherein the assembly is further configured to adjust a rate of fluid flow in at least one of the first pipe and the second pipe by adjusting at least one of the magnetic field and the electrical current.
4. The heat sink of claim 1 , wherein the assembly is disposed at a second end of at least a portion of the first pipe and a portion of the second pipe.
5. The heat sink of claim 4 , wherein the first and second pipe contain at least one ninety degree bend.
6. The heat sink of claim 1 , wherein the first pipe is configured to linearly extend through the heat sink.
7. The heat sink of claim 1 , wherein the assembly is arranged to direct fluid in the second pipe away from the hot spot.
8. The heat sink of claim 1 , wherein the assembly is arranged to direct fluid in the first pipe outside of the second pipe toward the hot spot.
9. The heat sink of claim 1 , wherein the assembly further comprises:
a plurality of magnets disposed between a portion of the first pipe and a portion of the second pipe.
10. The heat sink of claim 9 , wherein the assembly further comprises:
a ferromagnetic metal piece arranged to at least partially shield a magnetic field generated between the plurality of magnets.
11. The heat sink of claim 1 , wherein the heat sink is operatively connected to an integrated circuit.