IP Library Granted Patent US 7,804,970
Granted Patent B2
US 7,804,970 · App. 11/257,383 · Granted Sep 28, 2010

Array interconnect for improved directivity

Assignee: SonoSite, Inc.
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Quick Facts
Patent No.
US 7,804,970
App. No.
11/257,383
Granted
Sep 28, 2010
Kind
B2
Abstract

Systems and methods which improve the directivity of a transducer array by reducing electrical cross-talk between conductors connected to individual transducer array elements through the use of a plurality of interconnect circuits are shown. A plurality of signal transmission path circuits, such as circuit boards, flexible printed circuits, etc., are used to provide electrical power to and receive signals from transducer elements of a transducer array. Embodiments couple transducer elements to conductive traces of the signal transmission path circuits in a manner such that adjacent transducer elements are not connected to conductive traces on the same signal transmission path circuit. In some embodiments, a plurality of signal transmission path circuits are offset such that two identical signal transmission path circuits can be used to provide connectivity to array transducer elements using more widely spaced conductive traces, thus reducing electrical cross-talk effects.

Claims (40)

1. A method for improving the directivity of an acoustic transducer array comprising:

providing a transducer comprising a plurality of transducer elements in a one-dimensional array;

providing a plurality of signal transmission path circuits, each signal transmission path circuit comprising at least one conductive trace, said signal transmission path circuits positioned adjacent to said transducer elements;

forming a backing block of a matrix material and machining said matrix material to expose conductive trace material of said conductive traces;

coupling a first group of non-adjacent transducer elements of said transducer elements to conductive traces of a first signal transmission path circuit of said plurality of signal transmission path circuits; and

coupling a second group of non-adjacent transducer elements of said transducer elements to conductive traces of a second signal transmission path circuit of said signal transmission path circuits.

2. The method of claim 1 wherein said signal transmission path circuits comprise flexible circuits.

3. The method of claim 2 wherein said flexible circuits are flexible printed circuits.

4. The method of claim 1 wherein said transducer comprises a curved transmit/receive head.

5. The method of claim 1 wherein said transducer comprises a linear transmit/receive head.

6. The method of claim 1 wherein said providing a plurality of signal transmission path circuits comprises providing a plurality of flexible circuits that are offset relative to each other along the long axis of said transducer array.

7. The method of claim 1 wherein said providing a plurality of signal transmission path circuits comprises providing a plurality of substantially identical flexible circuits.

8. The method of claim 1 wherein said providing a plurality of signal transmission path circuits comprises providing a plurality of flexible circuits comprising a ground plane.

9. A method for improving the directivity of an acoustic transducer array comprising:

providing a transducer comprising a plurality of transducer elements in a one-dimensional array;

providing a plurality of signal transmission path circuits, each signal transmission path circuit comprising at least one conductive trace, said signal transmission path circuits positioned adjacent to said transducer elements;

coupling a first group of non-adjacent transducer elements of said transducer elements to conductive traces of a first signal transmission path circuit of said plurality of signal transmission path circuits;

coupling a second group of non-adjacent transducer elements of said transducer elements to conductive traces of a second signal transmission path circuit of said signal transmission path circuits; and

coupling a third group of non-adjacent transducer elements of said transducer elements to conductive traces of a third signal transmission path circuit of said signal transmission path circuits.

10. A method for improving the directivity of an acoustic transducer array comprising:

providing a transducer comprising a plurality of transducer elements in a one-dimensional array;

providing a plurality of signal transmission path circuits, each transmission path circuit comprising at least one conductive trace, said signal transmission path circuits positioned adjacent to said transducer elements;

coupling a first group of non-adjacent transducer elements of said transducer elements to conductive traces of a first signal transmission path circuit of said plurality of signal transmission path circuits;

coupling a second group of non-adjacent transducer elements of said transducer elements to conductive traces of a second signal transmission path circuit of said signal transmission path circuits;

wherein said providing a plurality of signal transmission path circuits comprises providing a plurality of flexible circuits comprising at least one guide hole.

11. An acoustic transducer apparatus comprising:

a plurality of transducer elements formed in a one-dimensional array;

a plurality of flexible circuits, each flexible circuit comprising at least one conductive trace, said at least one conductive traces alternatingly coupled electrically to ones of said plurality of transducer elements such that adjacent transducer elements are coupled to conductive traces on different flexible circuits of said plurality of flexible circuits; and

a backing block of matrix material, wherein said matrix material exposes conductive trace material of said at least one conductive traces.

12. The acoustic transducer apparatus of claim 11 wherein said flexible circuits are flexible printed circuits.

13. The acoustic transducer apparatus of claim 11 wherein said one-dimensional array is formed in a flat linear backing block.

14. The acoustic transducer apparatus of claim 11 wherein said one-dimensional array is formed in a curved backing block.

15. The acoustic transducer apparatus of claim 11 wherein said plurality of flexible circuits are offset relative to each other along the long axis of said array.

16. The acoustic transducer apparatus of claim 11 wherein said flexible circuits comprise a ground plane.

17. An acoustic transducer apparatus comprising:

a plurality of transducer elements formed in a one-dimensional array;

a plurality of flexible circuits, each flexible circuit comprising at least one conductive trace, said at least one conductive traces alternatingly coupled electrically to ones of said plurality of transducer elements such that adjacent transducer elements are coupled to conductive traces on different flexible circuits of said plurality of flexible circuits;

wherein said plurality of flexible circuits comprise at least one guide hole for receiving at least one dowel pin.

18. The acoustic transducer apparatus of claim 17 wherein said flexible circuits are offset relative to each other along the long axis of said transducer array when at least one dowel pin is inserted in said at least one guide hole of said flexible circuits.

19. The acoustic transducer apparatus of claim 17 wherein said flexible circuits are substantially identical.

Assignments (2)
CHANGE OF NAME Recorded Feb 20, 2015
From: SONOSITE, INC.
To: FUJIFILM SONOSITE, INC.
Reel/Frame 035059/0151 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2006
From: HIPPE, RICK; LI, WEI; COLEMAN, ALLAN
To: SONOSITE, INC.
Reel/Frame 017440/0376 →
Continuity (1)
Related Publication 20070093715A1 · Apr 26, 2007