Flexible wiring board for tape carrier package having improved flame resistance
View Patent ↗A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.
1. A flexible wiring board for tape carrier package having improved flame resistance, comprising
an insulating film having a bending slit,
a wiring pattern formed on the insulating film and crossing the bending slit,
an adhesive layer adhering the wiring pattern to the insulating film,
a flex resin layer protecting at least one side of the wiring pattern at the bending slit, and
an overcoat layer protecting a region where the wiring pattern is formed;
wherein the overcoat layer is a layer of cured material of a curable resin composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.
2. A flexible wiring board for tape carrier package according to claim 1 , wherein a laminate of the flex resin layer, the insulating film, the adhesive layer and the overcoat layer in this order has a flame resistance satisfying UL 94 V-0 standard.
3. A flexible wiring board for tape carrier package according to claim 1 , wherein the overcoat layer is a cured film obtained from either of a modified polyimide resin composition and a modified polyamideimide resin composition.
4. A flexible wiring board for tape carrier package according to claim 3 , wherein the overcoat layer is a cured film obtained from either of a modified polyimide resin composition and a modified polyamideimide resin composition;
wherein the modified polyimide resin composition and a modified polyamideimide resin composition each comprise a polymer having a segment selected from the group consisting of polysiloxane segment, hydrogenated polybutadiene segment and polycarbonate segment.
5. A flexible wiring board for tape carrier package according to claim 3 , wherein the overcoat layer comprises a polymer having polysiloxane segment in molecule.
6. A flexible wiring board for tape carrier package according to claim 3 , wherein the overcoat layer is a cured film obtained from either of a modified polyimide resin composition and a modified polyamideimide resin composition;
wherein the modified polyimide resin composition comprise polyimidesiloxane having imide groups and polysiloxane segment, and the modified polyamideimide resin composition comprise polyamideimidesiloxane having amide groups, imide groups and polysiloxane segment.
7. A flexible wiring board for tape carrier package according to claim 1 , wherein the overcoat layer comprises a polymer having polysiloxane segment in molecule.
8. A flexible wiring board for tape carrier package according to claim 1 , wherein the overcoat layer is a cured film obtained from a curable resin composition containing at least an inorganic filler selected from the group consisting of talc, mica and barium sulfate, in an amount of 10 to 150 parts by weight relative to 100 parts by weight of the resin solid.
9. A tape carrier package comprising a flexible wiring board for tape carrier package as claimed in claim 1 .
10. A curable resin composition for the overcoat layer of a flexible wiring board for tape carrier package as claimed in claim 1 , the composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.