Granted Patent B2

US 7,524,915 · App. 11/260,598 · Granted Apr 28, 2009

Abstract

Claims (15)

1. A process for making a moisture-curable silylated resin composition comprising reacting in the presence or absence of catalyst at least one polyether polyol (i), at least one polyisocyanate (ii) and at least one isocyanatosilane (iii), the NCO/OH ratio of the polyisocyanate (ii) and the polyol (i) being from about 0.1 to about 0.9 and the NCO/OH ratio of the isocyanatosilane (iii) and polyol (i) being from about 0.9 to about 0.1, provided, when hydroxyl-terminated polyurethane prepolymer prior to completion of the polyurethane prepolymer-forming reaction wherein the hydroxyl-terminated polyurethane prepolymer reaction medium has an isocyanate concentration of at least 0.03 % NCO, isocyanatosilane (iii) is added to the reaction medium to produce silylated polyurethane and wherein the process is a two-step process comprising:

(1) reacting polyol (i) with part of polyisocyanate (ii); and

(2) reacting the composition of step (1) with the remaining part of polyisocyanate (ii) and all of isocyanatosilane (iii).

2. The process for making a moisture-curable silylated resin composition according to claim 1 wherein the hydroxyl-terminated polyurethane prepolymer reaction medium has an isocyanate concentration of about 0.06 % to about 0.08 % NCO.

3. The process for making a moisture-curable silylated resin composition according to claim 1 wherein the NCO/OH ratio of the polyisocyanate (ii) and the polyol (i) is between about 0.4 and about 0.75.

4. The process for making a moisture-curable silylated resin composition according to claim 1 wherein polyol (i) is a polyether diol, polyisocyanate (ii) is a diisocyanate and isocyanatosilane (iii) possesses a single isocyanate group.

5. The process for making a moisture-curable silylated resin composition according to claim 4 wherein the polyether diol is a polypropylene ether diol.

6. The process for making a moisture-curable silylated resin composition according to claim 4 wherein the polyol is a polypropylene ether diol having a number average molecular weight between about 2,000 and about 20,000.

7. The process for making a moisture-curable silylated resin composition according to claim 6 wherein the polyol is a polypropylene ether diol having a number average molecular weight of at least about 4,000.

8. The process for making a moisture-curable silylated resin composition according to claim 6 wherein the polyol is a polypropylene ether diol having a number average molecular weight of at least about 8,000.

9. The process for making a moisture-curable silylated resin composition according to claim 4 wherein the diisocyanate is selected from the group consisting of ethylene diisocyanate, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, cylcohexane-1,4-disocyanate, 4,4′-dicyclohexylmethane diisocyanate, 1,4-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, polymeric diphenylmethane diisocyanate, cyclohexane diisocyanate, phenylene diisocyanate and mixtures thereof.

10. The process for making a moisture-curable silylated resin composition according to claim 4 wherein the isocyanatosilane (iii) corresponds to the general formula

OCN—R 1 —Si(R 2 ) n (OR 3 ) 3-n

in which R 1 is an alkylene group having from 1-10 carbon atoms, R 2 and R 3 each are the same or different alkyl groups having from 1-10 carbon atoms, and n is 0, 1 or 2.

11. The process for making a moisture-curable silylated resin composition according to claim 10 wherein the isocyanatosilane is selected from the group consisting of 3-isocyanatopropylmethyldimethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane and mixtures thereof.

Assignments (27)