Synthesis of metallic nanoparticle dispersions capable of sintering at low temperatures
A process is described for the synthesis of metallic nanoparticles by chemical reduction of metal salts in the presence of organic ligands capable of binding to the metal particle surfaces and stabilizing them against agglomeration. The resultant nanoparticles or dispersions of the particles can be sintered into highly conductive films or traces at temperatures as low as 80° C. in 10 minutes or less.
1. A method of synthesizing a metallic nanoparticle composition, comprising:
dissolving silver nitrate in water and combining the dissolved silver nitrate with an admixture comprising water, a base, a carboxylic acid including from 3 to 7 carbons, and a reducing agent, so as to give rise to one or more metallic nanoparticles comprising silver.
2. The method of claim 1 , wherein the reducing agent comprises hydrazine.
3. The method of claim 1 , wherein the carboxylic acid comprises heptanoic acid.
4. The method of claim 1 , wherein the base comprises ammonium hydroxide.
5. The method of claim 1 , wherein the weight ratio of silver nitrate to water in the second admixture is about 1:5.
6. The method of claim 1 , wherein the dissolved silver nitrate and the admixture are combined under nitrogen.
7. The method of claim 1 , wherein the metallic nanoparticles are capable of sintering together when cured at 100° C. for from about 1 to about 2 minutes.
8. The method of claim 1 , wherein the metallic nanoparticles are capable of sintering together when cured at 80° C. for from about 1 to about 2 minutes.
9. A method of forming a conductive cohesive film on a substrate, comprising:
depositing a metallic nanoparticle composition comprising silver; and
curing the composition so as to form a conductive, cohesive film comprising a plurality of sintered metallic nanoparticles,
wherein the nanoparticle composition is made by dissolving silver nitrate in water and combining the dissolved silver nitrate with an admixture comprising water, a base, a carboxylic acid including from 3 to 7 carbons, and a reducing agent, second so as to give rise to one or more metallic nanoparticles comprising silver.
10. The method of claim 9 , wherein the conductive cohesive film has a bulk resistivity of about twice that of bulk silver.
11. The method of claim 10 , wherein the curing takes place at least about 80° C.
12. The method of claim 9 , wherein the reducing agent comprises hydrazine.
13. The method of claim 9 , wherein the carboxylic acid comprises heptanoic acid.
14. The method of claim 9 , wherein the base comprises ammonium hydroxide.
15. The method of claim 9 , wherein the weight ratio of silver nitrate to water in the second admixture is about 1:5.
16. The method of claim 9 , wherein the dissolved silver nitrate and the admixture are combined under nitrogen.
17. The method of claim 9 , wherein the curing takes place at least about 80° C.