IP Library Granted Patent US 7,505,251
Granted Patent B2
US 7,505,251 · App. 11/262,047 · Granted Mar 17, 2009

Actuation mechanism for mating electronic card interconnect systems

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Quick Facts
Patent No.
US 7,505,251
App. No.
11/262,047
Granted
Mar 17, 2009
Kind
B2
Abstract

An actuation assembly and method is provided for mating electronic unto a computer rack comprising a main housing engageably securable to a slide assembly. The slide assembly is capable of being secured to a side of the computer rack and having sliding features such that the slide assembly and the main housing when engaged can be telescoped out or returned to a closed position. The main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving the vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw.

Claims (21)

1. An actuation assembly provided for mating electronic unto a computer rack, comprising:

a main housing engageably securable to a slide assembly;

said slide assembly capable of being secured to a side of said computer rack and having sliding features such that said slide assembly and said main housing when engaged can be telescoped out or returned to a closed position;

said main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving said vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw wherein said assembly is mounted to a side of said rack such that said slide mechanism can be extended out from said rack to be connected to an electronic card.

2. The assembly of claim 1 , wherein of said slide mechanisms further comprises:

a fixed housing engageable to said sliding features.

3. The assembly of claim 2 , wherein said slide mechanism includes a ditente feature to provide multiple, controlled deployment position for said assembly.

4. The assembly of claim 3 , wherein said fixed housing portion of each slide mechanism is affixed to said wedge.

5. The assembly of claim 4 , wherein said assembly includes connectors to connect to a computer rack housing electronic components installed on a mother board and a daughter board.

6. The assembly of claim 5 , wherein said rack houses one or more central electronic complexes (CECs) and includes at least a mid-plane.

7. The assembly of claim 6 , wherein said main housing includes mating components for mating to pin retention features on said mid-plane.

8. The assembly of claim 2 , wherein said vertical wedge and said housing are formed such that they accommodate a connector system, said connector system further comprising of a pin and hole feature respectively such as to provide a dwell feature.

9. The assembly of claim 8 , wherein said amount of movement of said dwell feature can be selectively altered by said pin and hole relationship.

10. The assembly of claim 1 , wherein said assembly is formed from cast or machined aluminum.

11. The assembly of claim 1 , wherein said assembly is formed from structural polymer.

12. The assembly of claim 1 , wherein said assembly is fabricated out of structural polymer.

13. The assembly of claim 2 , wherein said slide mechanism further comprise a lead screw and roller ball bearing.

14. The assembly of claim 13 , wherein said slide mechanism is formed from machined steel.

15. The assembly of claim 6 , further comprising a surface mount interconnect feature is provided to connect said assembly to a mid-plane connector of a computing environment, and at least one stiffening member attached to said surface-mount interconnect, such as that said stiffening member is also fastened to a connector on a logic card residing in said computing environment.

16. The assembly of claim 15 , wherein a guidance mechanism is provided to enhance connection and mating of said logic card to said assembly.

17. The assembly of claim 16 , wherein said stiffening member is formed from a cast or machined metal or metallic molded polymer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 034194/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2006
From: CANFIELD, SHAWN M.; LOPARCO, JOHN J.; LOPERGOLO, EMANUELE F.; NOTOHARDJONO, BUDY D.; PEETS, MICHAEL T.; TOROK, JOHN G.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 017162/0959 →