Manufacturing structure
This utility discloses a manufacturing structure, suitable for at least one component that accomplishes manufacturing structure with high density and high suppleness. This structure comprises a substrate and at least one hole. These holes are arranged to be an array on the substrate. The size of the hole tallies with the size of the single component that is set into each hole one by one. At the same time, on the substrate, the single component can be a selection unit that selects a distribution area for dividing. By way of mentioned above, the manufacturing structure with high density and high suppleness can be obtained and avoids the waste of the manufacturing cost.
1 . A manufacturing structure, being applied for at least one component, at least comprising:
a substrate; and
at least one hole produced on said substrate and set said component into said hole.
2 . The manufacturing structure of claim 1 , wherein said hole is arranged to be an array.
3 . The manufacturing structure of claim 1 , wherein said substrate selects a distribution area for dividing.
4 . The manufacturing structure of claim 3 , wherein said distribution area is composed of at least one selection unit, said selection unit is a single said component.
5 . The manufacturing structure of claim 1 , wherein said component is a die.
6 . The manufacturing structure of claim 5 , wherein said ship is a Light Emitting Diode (LED).
7 . The manufacturing structure of claim 1 , wherein said substrate is a ceramic substrate.
8 . The manufacturing structure of claim 1 , wherein said substrate is a glass substrate.
9 . The manufacturing structure of claim 1 , wherein said substrate is a silicon substrate.
10 . The manufacturing structure of claim 1 , wherein the size of said hole corresponds to the size of said component.
11 . The manufacturing structure of claim 10 , wherein said hole is a circular hole.
12 . The manufacturing structure of claim 10 , wherein said hole is a square hole.