IP Library Granted Patent US 7,161,414
Granted Patent B2
US 7,161,414 · App. 11/265,156 · Granted Jan 9, 2007

Semiconductor integrated circuit device

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Quick Facts
Patent No.
US 7,161,414
App. No.
11/265,156
Granted
Jan 9, 2007
Kind
B2
Abstract

A semiconductor integrated circuit device for fast and low power operations, comprising a plurality of circuit blocks of a chip, each of which has a plurality of states with different power consumption values. A power management circuit determines the state of each of the circuit blocks so as not to exceed a maximum power consumption value of the semiconductor integrated circuit device by considering the power consumption of each circuit block and by each state transition in each circuit block. The maximum power consumption value may be preset or adjustable after fabrication.

Claims (51)

1. A semiconductor integrated circuit device comprising:

a plurality of circuit blocks, each of the plurality of circuit blocks having at least a first state and a second state;

wherein each of the circuit blocks comprises a power line which supplies a supply voltage;

wherein the supply voltage in the first state is higher than the supply voltage in the second state; and

wherein a state transition from the second state to the first state in each of the circuit blocks is permitted if a power consumption of the semiconductor integrated circuit device does not exceed a preset maximum power consumption of the semiconductor integrated circuit device.

2. The semiconductor integrated circuit device according to claim 1 ,

wherein each of the circuit blocks comprises a storage element; and

wherein the supply voltage is set so as not to erase information stored in the storage element.

3. The semiconductor integrated circuit device according to claim 2 , wherein the storage element is a flip-flop.

4. The semiconductor integrated circuit device according to claim 1 , further comprising:

a power manager circuit;

wherein the manager circuit controls the supply voltage of each of the circuit blocks.

5. A semiconductor integrated circuit device, comprising:

a plurality of circuit blocks;

wherein each of the circuit blocks comprises a means for changing an operational frequency of a distributed clock into each of the circuit blocks;

wherein the operational frequency in a first state is higher than the operational frequency in a second state; and

wherein the state transition from the second state to the first state is permitted in each of the circuit blocks if a power consumption of the semiconductor integrated circuit device does not exceed a preset maximum power consumption of the semiconductor integrated circuit device.

6. The semiconductor integrated circuit device according to claim 5 ,

wherein the means for changing the operation frequency is a divider circuit or a phase locked loop circuit.

7. The semiconductor integrated circuit device according to claim 5 , further comprising:

a power manager circuit;

wherein the manager circuit controls the means for changing operational frequency of each of the circuit blocks.

8. A semiconductor integrated circuit device, comprising:

a plurality of circuit blocks;

wherein each of the circuit blocks comprises a power line which supplies a supply voltage and a means for changing an operational frequency of a distributed clock into each of the circuit blocks;

wherein the supply voltage in a first state is higher than the supply voltage in a second state;

wherein the frequency in the first state is higher than the frequency in a second state; and

wherein the state transition from the second state to the first state is permitted in each of the circuit blocks if a power consumption of the semiconductor integrated circuit device does not exceed a preset maximum power consumption of the semiconductor integrated circuit device.

9. The semiconductor integrated circuit device according to claim 8 ,

wherein each of the circuit blocks comprises a storage element; and

wherein the supply voltage is set so as not to erase the information stored in the storage element.

10. The semiconductor integrated circuit device according to claim 9 , wherein the storage element is a flip-flop.

11. The semiconductor integrated circuit device according to claim 8 ,

wherein the means for changing the operational frequency is a divider circuit or a phase locked loop circuit.

12. The semiconductor integrated circuit device according to claim 8 , further comprising:

a power manager circuit;

wherein the manager circuit controls the supply voltage and the means for changing operational frequency of each of the circuit blocks.

13. The semiconductor integrated circuit device according to claim 8 , further comprising:

a memory;

wherein the memory stores the preset maximum power consumption.

14. The semiconductor integrated circuit device according to claim 13 ,

wherein the memory is a non-volatile memory.

15. The semiconductor integrated circuit device according to claim 8 ,

wherein the preset maximum power consumption is read from an external source when the semiconductor integrated circuit device is powered.

16. The semiconductor integrated circuit device according to claim 8 ,

wherein the preset maximum power consumption is changed after the semiconductor integrated circuit device is powered.

17. The semiconductor integrated circuit device according to claim 8 ,

wherein the preset maximum power consumption is changed according to a temperature of the semiconductor integrated circuit device.

18. The semiconductor integrated circuit device according to claim 8 ,

wherein a battery is used to drive the semiconductor integrated circuit device; and

wherein the preset maximum power consumption is changed according to a residual level of the battery.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 053654 FRAME: 0254. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED ON REEL 052853 FRAME 0153. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC; INNOVATIVE DISPLAY TECHNOLOGIES LLC; LIFEPORT SCIENCES LLC; LIMESTONE MEMORY SYSTEMS LLC; MOBILE ENHANCEMENT SOLUTIONS LLC; MONARCH NETWORKING SOLUTIONS LLC; NEXUS DISPLAY TECHNOLOGIES LLC; PARTHENON UNIFIED MEMORY ARCHITECTURE LLC; R2 SOLUTIONS LLC; SAINT LAWRENCE COMMUNICATIONS LLC; STINGRAY IP SOLUTIONS LLC; SUPER INTERCONNECT TECHNOLOGIES LLC; TELECONFERENCE SYSTEMS LLC; UNIFICATION TECHNOLOGIES LLC
Reel/Frame 053654/0254 →
PATENT SECURITY AGREEMENT Recorded Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC; INNOVATIVE DISPLAY TECHNOLOGIES LLC; LIFEPORT SCIENCES LLC; LIMESTONE MEMORY SYSTEMS LLC; MERTON ACQUISITION HOLDCO LLC; MOBILE ENHANCEMENT SOLUTIONS LLC; MONARCH NETWORKING SOLUTIONS LLC; NEXUS DISPLAY TECHNOLOGIES LLC; PARTHENON UNIFIED MEMORY ARCHITECTURE LLC; R2 SOLUTIONS LLC; SAINT LAWRENCE COMMUNICATIONS LLC; STINGRAY IP SOLUTIONS LLC; SUPER INTERCONNECT TECHNOLOGIES LLC; TELECONFERENCE SYSTEMS LLC; UNIFICATION TECHNOLOGIES LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
MERGER Recorded Jul 7, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024662/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2005
From: MIZUNO, HIROYUKI
To: HITACHI, LTD.
Reel/Frame 017187/0955 →