Continually variable demetallization of metallized films and similar objects

1. A method of forming a plurality of laminate patches in a demetallized holographic web, comprising the steps of:

for each of the laminate patches, imparting a same holographic microstructure pattern to an oligomer disposed on a surface of a substrate;

depositing a metal layer to said holographic microstructure patterns of said substrate to provide a metallized holographic web;

applying a resist pattern to said metal layer of said metallized holographic web; and

removing said metal layer not covered by said resist pattern so as to form a demetallized pattern on each of the holographic microstructure patterns whereby forming the plurality of laminate patches in the demetallized holographic web;

wherein, the demetallized pattern includes a fixed demetallization pattern and a variable demetallization pattern; and, for any first and second of the laminate patches,

the fixed demetallization pattern of the first laminate patch and the fixed demetallization pattern of the second laminate patch are a same pattern; and

the variable demetallization pattern of the first laminate patch is different from the variable demetallization pattern of the second laminate patch.

2. The method of claim 1 , wherein the step of depositing comprises the step of depositing a layer of aluminum to said holographic microstructure pattern.

3. The method of claim 1 , further comprising the step of applying adhesive to affix the laminate patches to documents.

4. The method of claim 3 , wherein said variable demetallization pattern is registered with information in said document.

5. The method of claim 1 , further comprising the step of disposing a release layer between said oligomer and said substrate.

6. The method of claim 1 , further comprising the step of disposing a release layer between said oligomer and said substrate, wherein a portion of said release layer remains affixed to said oligomer and a remaining portion of said release layer remains affixed to said substrate when said substrate is peeled back from said oligomer.

7. The method of claim 1 , wherein the step of applying comprises the step of applying resist ink through an inkjet head array of an ink jet printer.

8. The method of claim 7 , wherein the step of applying resist ink comprises step of controlling the application of said resist ink and the movement of said metallized holographic web to generate said resist pattern.

9. The method of claim 1 , wherein the variable demetallization pattern comprises at least one of the following: a serialized integer, an encoded character, a progressive geometric pattern, or a bar code.

10. The method of claim 1 , the variable demetallization pattern comprises information specific to a person, group or manufacturing lot.

11. The method of claim 1 , wherein said variable demetallization pattern is registered with said holographic microstructure pattern.

12. A batch of laminate patches, each comprising: a holographic microstructure pattern on an oligomer disposed on a surface of a substrate, wherein the holographic microstructure pattern is a same for all the laminate patches in the batch;

a metal layer deposited on said holographic microstructure pattern of said substrate;

a resist pattern applied to said metal layer for forming a demetallized pattern; and

the demetallized pattern formed by removing said metal layer not covered by said resist pattern;

wherein the demetallized pattern includes a variable demetallization pattern and a fixed demetallization pattern so as to provide that, for any first and second laminate patches in the batch,

the fixed demetallization pattern of the first laminate patch and the fixed demetallization pattern of the second laminate patch are a same pattern; and

the variable demetallization pattern of the first laminate patch is different from the variable demetallization pattern of the second laminate patch.

13. The batch of laminate patches of claim 12 , wherein said metal layer is a layer of aluminum.

14. The batch of laminate patches of claim 13 , wherein a portion of said release layer remains affixed to said oligomer and a remaining portion of said release layer remains affixed to said substrate when said substrate is peeled back from said oligomer.

15. The batch of laminate patches of claim 12 , wherein said substrate is affixed to a document.

16. The batch of laminate patches of claim 15 , wherein said variable demetallization pattern is registered with information in said document.

17. The batch of laminate patches of claim 12 , further comprising a release layer between said oligomer and said substrate.

18. The batch of laminate patches of claim 12 , wherein said resist pattern is formed by applying resist ink through an inkjet head array of an ink jet printer.

19. The batch of laminate patches of claim 18 , wherein said resist pattern is formed by controlling the application of said resist ink and the movement of said substrate.

20. The batch of laminate patches of claim 12 , wherein the variable demetallization pattern comprises at least one of the following: a serialized integer, an encoded character, or a progressive geometric pattern.

21. The batch of laminate patches of claim 12 , wherein said variable demetallization pattern is registered with said holographic microstructure.

22. The batch of laminate patches defined in claim 12 , wherein the variable demetallization pattern comprises an alphanumeric pattern.

23. The batch of laminate patches in claim 12 , wherein the variable demetallization pattern comprises a bar code pattern.

24. The batch of laminate patches defined in claim 12 , wherein the laminate patches are laminated onto identification cards.

25. The batch of laminate patches defined in claim 12 , wherein the fixed demetallization pattern covers 30-60% of the holographic microstructure pattern.

26. The batch of laminate patches defined in claim 12 , wherein the substrates of the laminate patches form a continuous web.