Lens in light emitting device
In an embodiment, there is disclosed an opto-electronic package, comprising a substrate, a plurality of light emitting diode (LED) dice, and at least one lens disposed between the cavity-defining walls and having a maximum height remaining within an aperture of an elongate cavity of the substrate. In an embodiment, there is disclosed a system for backlighting an LCD screen, the system comprising an opto-electronic package and a light guide. A method of manufacturing an opto-electronic package is disclosed, the method comprising fabricating a substrate, attaching a plurality of light emitting diode (LED) dice to the base of the substrate within the cavity, and disposing at least one lens between the cavity-defining walls and entirely within the aperture of the elongate cavity.
1 . An opto-electronic package, comprising:
a substrate having a base and a plurality of cavity-defining walls, the base and the plurality of cavity-defining walls defining an elongate cavity having a major axis, a minor axis and an aperture, and the base having a surface that presents within the cavity;
a plurality of light emitting diode (LED) dice mounted to the surface of the base that presents within the elongate cavity of the substrate so as to project light within the elongate cavity; and
at least one lens disposed between the cavity-defining walls and having a maximum height remaining within the aperture of the elongate cavity, and the at least one lens having a convex orientation relative to at least one of the plurality of light emitting diode (LED) dice along the minor axis of the elongate cavity of the substrate.
2 . The package of claim 1 , wherein the at least one lens comprises an encapsulation material disposed over the light emitting diode (LED) within the elongated cavity.
3 . The package of claim 2 , wherein the encapsulation material comprises epoxy.
4 . The package of claim 2 , wherein the encapsulation material comprises silicone.
5 . The package of claim 1 , wherein the at least one lens comprises a plastic lens disposed over the light emitting diode (LED) within the elongated cavity.
6 . The package of claim 5 , further comprising an encapsulation material disposed over the light emitting diode (LED) and within the plastic lens.
7 . The package of claim 6 , wherein the encapsulation material comprises epoxy.
8 . The package of claim 6 , wherein the encapsulation material comprises silicone.
9 . The package of claim 1 , wherein the at least one lens is a single lens disposed over the plurality of light emitting diode (LED) dice mounted to the surface of the base that presents within the elongate cavity of the substrate.
10 . The package of claim 9 , wherein the single lens comprises an encapsulation material disposed over the light emitting diode (LED) within the elongated cavity.
11 . The package of claim 10 , wherein the encapsulation material comprises epoxy.
12 . The package of claim 10 , wherein the encapsulation material comprises silicone.
13 . The package of claim 9 , wherein the single lens comprises a plastic lens disposed over the light emitting diode (LED) within the elongated cavity.
14 . The package of claim 13 , further comprising an encapsulation material disposed over the light emitting diode (LED) and within the plastic lens of the single lens.
15 . The package of claim 14 , wherein the encapsulation material comprises epoxy.
16 . The package of claim 14 , wherein the encapsulation material comprises silicone.
17 . The package of claim 9 , wherein the single lens comprises a substantially cylindrical portion having a substantially uniform height in a direction parallel to the major axis of the substrate.
18 . The package of claim 1 , wherein the at least one lens comprises a plurality of lens portions, corresponding ones of the plurality of light emitting diode (LED) dice and ones of the plurality of lens portions in operational association with one another, respectively.
19 . The package of claim 18 , wherein the plurality of lens portions each comprise a first length and a second length, the first length extending parallel to the major axis, the second length extending in a direction parallel to the minor axis, and the first length extending a longer distance than the second length.
20 . The package of claim 19 , wherein each one of the plurality of lens portions are discrete from the other ones of the plurality of lens portions.
21 . The package of claim 18 , wherein the plurality of lens portions each comprise an encapsulation material disposed over the light emitting diode (LED) within the elongated cavity.
22 . The package of claim 21 , wherein the encapsulation material comprises epoxy.
23 . The package of claim 21 , wherein the encapsulation material comprises silicone.
24 . The package of claim 18 , wherein the plurality of lens portions each comprise a plastic lens disposed over the light emitting diode (LED) within the elongated cavity.
25 . The package of claim 24 , further comprising an encapsulation material disposed over the light emitting diode (LED) and within the plastic lens.
26 . The package of claim 25 , wherein the encapsulation material comprises epoxy.
27 . The package of claim 25 , wherein the encapsulation material comprises silicone.
28 . The package of claim 1 , wherein maximum height of the at least one lens is co-planar with the aperture of the elongate cavity.
29 . The package of claim 1 , wherein the substrate has a first end and a second end in opposition to one another along the major axis, and wherein the cavity defining walls define a first hole therethrough at the first end and define a second hole therethrough at the second end.
30 . The package of claim 1 , wherein the substrate comprises a plastic material.
31 . The package of claim 1 , wherein the substrate comprises a ceramic material.
32 . A system for backlighting an LCD screen, the system comprising:
an opto-electronic package, comprising:
a substrate having a base and a plurality of cavity-defining walls, the base and the plurality of cavity-defining walls defining an elongate cavity having a major axis, a minor axis and an aperture, and the base having a surface that presents within the cavity;
a plurality of light emitting diode (LED) dice mounted to the surface of the base that presents within the elongate cavity of the substrate so as to project light within the elongate cavity; and
at least one lens disposed between the cavity-defining walls and having a maximum height remaining within the aperture of the elongate cavity, and the at least one lens having a convex orientation relative to at least one of the light emitting diode (LED) dice along the minor axis of the elongate cavity of the substrate; and
a light guide having an input portion and an output portion, the input portion operatively associated with the aperture to receive light provided by the plurality of light emitting dice (LED) dice, and the output portion operatively associated with the LCD screen to transmit the light from the input portion to the LCD screen.
33 . A method of manufacturing an opto-electronic package, comprising:
fabricating a substrate having a base and a plurality of cavity-defining walls, the base and the plurality of cavity-defining walls defining an elongate cavity having a major axis and an aperture, the base having a surface that presents within the cavity;
attaching a plurality of light emitting diode (LED) dice to the base of the substrate within the cavity; and
disposing at least one lens between the cavity-defining walls and entirely within the aperture of the elongate cavity, and the at least one lens having a convex orientation relative to at least one of the plurality of light emitting diode (LED) dice along the minor axis of the elongate cavity of the substrate.
34 . The method of claim 33 , wherein disposing the at least one lens between the cavity-defining walls and entirely within the aperture comprises disposing an encapsulation material over the plurality of light emitting diode (LED) dice within the elongated cavity, and curing the encapsulation material so as to form the at least one lens with the encapsulation material.
35 . The method of claim 33 , wherein disposing the at least one lens between the cavity-defining walls and entirely within the aperture comprises disposing a plastic lens over the plurality of light emitting diode (LED) dice within the elongated cavity, disposing an encapsulation material within the plastic lens and over the plurality of light emitting diode (LED) dice, and curing the encapsulation material so as to form the at least one lens with the plastic lens and the encapsulation material.
36 . The method of claim 33 , wherein disposing a jig through the aperture into the elongated cavity and over the plurality of light emitting diode (LED) dice, disposing an encapsulation material within the jig and over the plurality of light emitting diode (LED) dice, curing the encapsulation material so as to form the at least one lens with the encapsulation material, and removing the jig from the elongated cavity through the aperture.
37 . The method of claim 36 , further comprising positioning the substrate to align the major axis in a vertical direction, and disposing the encapsulation material through a first hole defined in the first end into the elongated cavity within the jig and over the plurality of light emitting diode (LED) dice.
38 . An opto-electronic package, comprising:
a substrate having a base and a plurality of cavity-defining walls, the base and the plurality of cavity-defining walls defining an elongate cavity and an aperture, and the base having a surface that presents within the cavity;
a plurality of light emitting diode (LED) dice mounted to the surface of the base that presents within the elongate cavity of the substrate so as to project light within the elongate cavity; and
encapsulation material disposed between the cavity-defining walls and having a maximum height remaining within the aperture of the elongate cavity, the encapsulation material having a plurality of dimples formed therein.