Compact printed filters with self-connected LC resonators
View Patent ↗An LC filter structure and method for its fabrication, in which multiple shunt capacitors, multiple shunt inductors and multiple coupling inductors are printed on a metal layer formed on a thin dielectric substrate. The capacitors have first electrodes that are formed as spatially separated regions of the metal layer, and a common second electrode formed by a ground plane on the substrate. The shunt inductors are formed as spiral traces connected to the separated regions and to the ground plane, through conductive vias. The coupling inductors are similarly formed as spiral traces in the gaps between the separated regions, the ends of each coupling inductor being connected to respective adjacent regions of the metal layer.
1. An inductive-capacitive (LC) filter, comprising:
a dielectric substrate having first and second opposing faces;
a patterned metal layer disposed on the first face of the substrate;
a ground plane disposed on the second face of the substrate;
at least one shunt capacitor having a first electrode provided by a selected region of the metal layer, and a second electrode provided by the ground plane; and
at least one inductor provided integrally with the metal layer;
wherein the shunt capacitor and the inductor are integrated into the filter without external ribbon connections;
wherein the at least one inductor comprises at least one shunt inductor provided as a metal trace within the selected region of a corresponding shunt capacitor.
2. An inductive-capacitive (LC) filter as defined in claim 1 , wherein:
the filter comprises a plurality of shunt capacitors having first electrodes provided by separate regions of the metal layer, wherein the plurality of shunt capacitors comprise the at least one shunt capacitor; and
the at least one inductor comprises at least one shunt inductor having thereof connected, respectively, to one of the separate regions of the metal layer and to the ground plane, and at least one coupling inductor having thereof connected to adjacent separate regions of the metal layer.
3. An inductive-capacitive (LC) filter as defined in claim 1 , wherein:
adjacent regions of the metal layer are separated by the gaps that include a portion that is widened to accommodate coupling inductors and other portions that are narrowed as needed to minimize device length and obtain desired shunt capacitor values.
4. An inductive-capacitive (LC) filter, comprising:
a dielectric substrate having first and second opposing faces; a patterned metal layer disposed on the first face of the substrate as a plurality of segments that are spaced apart;
a ground plane disposed on the second face of the substrate;
a plurality of shunt capacitors, wherein each shunt capacitor is provided between a respective segment of the patterned metal layer and the ground plane;
a plurality of shunt inductors, wherein each shunt inductor is provided as a respective spiral metal trace in a respective segment of a corresponding shunt capacitor, wherein one end of the respective spiral metal trace is electrically connected to the corresponding segment of the metal layer and the other end of the respective spiral metal trace is connected to the ground plane through a corresponding plated via hole disposed through the substrate; and
a plurality of coupling inductors, wherein each coupling inductor is provided as a respective spiral metal trace in the patterned metal layer, disposed between adjacent ones of the segments of the patterned metal layer and having inner and outer ends thereof coupled, respectively, to the adjacent segments.
5. An inductive-capacitive (LC) filter as defined in claim 4 , wherein:
each of the shunt inductors further comprises a respective conductive metal trace connecting one end of the corresponding inductor to a segment of the metal layer, and a respective conductive via for making electrical connection between the opposite end of the corresponding inductor and the ground plane; and
each of the coupling inductors further comprises a respective conductive metal trace connecting the outer end of the corresponding inductor to one segment of the metal layer, and a respective conductive structure for making electrical connection between the inner end of the corresponding inductor and an adjacent segment of the metal layer.
6. An inductive-capacitive (LC) filter as defined in claim 5 , wherein the respective conductive structure making connection to the inner end of the corresponding coupling inductor comprises an airbridge.
7. An inductive-capacitive (LC) filter as defined in claim 5 , wherein:
the dielectric substrate is of alumina.
8. An inductive-capacitive (LC) filter as defined in claim 5 , wherein:
adjacent segments of the metal layer are separated by gaps that include a portion that is widened to accommodate the corresponding coupling inductors and other portions that are narrowed as needed to minimize device length and obtain desired shunt capacitor values.
9. An inductive-capacitive (LC) filter as defined in claim 5 , wherein the respective conductive structure making connection to the inner end of the corresponding coupling inductor comprises a ribbon bond.
10. A method for fabricating an inductive-capacitive (LC) filter, comprising:
providing a dielectric substrate having opposing first and second faces;
forming a metal layer on the first face of the substrate;
forming a ground plane on the second face of the substrate;
patterning the metal layer to form (a) a plurality of metal regions that are spatially separated by non-conductive gaps, wherein each region is sized to provide a desired capacitance value in cooperation with the ground plane and the dielectric substrate, (b) a plurality of shunt inductors, each formed within each region of the plurality of regions, and (c) a plurality of coupling inductors in the gaps between adjacent regions;
forming, as part of the patterning step, an electrical connection between each shunt inductor and the corresponding region of the metal layer in which it is formed, and electrical connections between a first end of each coupling inductor and one of the adjacent regions of the metal layer;
forming a respective conductive via connection between each shunt inductor and the ground plane; and
forming a respective conductive connection between a second end of each coupling inductor and the other of the adjacent regions of the metal layer.
11. A method as defined in claim 10 , wherein the step of forming a conductive connection with the second end of each coupling inductor comprises forming an airbridge.
12. A method as defined in claim 10 , wherein the step of patterning the metal layer to form the plurality of regions that are spatially separated by the gaps comprises patterning the metal layer to form the gaps that include a portion that is widened to accommodate the corresponding coupling inductors and other portions that are narrowed as needed to minimize device length and obtain the corresponding desired capacitance values.
13. A method as defined in claim 10 , wherein the step of forming a conductive connection with the second end of each coupling inductor comprises making a ribbon bond connection.