Field effect transistor
View Patent ↗A novel field-effect transistor is provided which employs an amorphous oxide. In an embodiment of the present invention, the transistor comprises an amorphous oxide layer containing electron carrier at a concentration less than 1×10 −18 /cm 3 , and the gate-insulating layer is comprised of a first layer being in contact with the amorphous oxide and a second layer different from the first layer.
1. A field-effect transistor provided with a source electrode, a drain electrode, a gate insulator, a gate electrode, and a transparent channel layer, wherein
the channel layer comprises an amorphous oxide of a compound having
(a) a composition when in crystalline state represented by In 2−x M3 x O 3 (Zn 1−y M2 y O) m , wherein M2 is Mg or Ca; M3 is B, Al, Ga or Y; 0≦x ≦2; 0≦y ≦1; and m is zero or a natural number less than 6, or a mixture of said compounds;
(b) an electric carrier concentration of 10 12 /cm 3 or more and less than 10 18 /cm 3 , wherein an electron mobility of the channel layer tends to increase with increase of the electron carrier concentration; and
(c) controlled oxygen defect density resulting from subjecting the amorphous oxide to treatment in an atmosphere containing oxygen at a predetermined pressure upon or after film formation; and
at least one of the source electrode, the drain electrode and the gate electrode is transparent to visible light, wherein current between the drain electrode and the source electrode when no gate voltage is applied is less than 10 microamperes.
2. The field effect transistor according to claim 1 , which has a metal wiring connected to at least one of the source electrode, the drain electrode and the gate electrode.
3. The field effect transistor according to claim 1 , wherein the amorphous oxide is an oxide containing at least one of In, Zn, and Sn, or an oxide containing In, Zn, and Ga.
4. The field-effect transistor according to claim 1 , wherein a metal wiring is connected to an electrode transparent to light which belongs to the source electrode, the drain electrode or the gate electrode.
5. The field-effect transistor according to claim 1 , wherein the amorphous oxide is any one selected from the group consisting of an oxide containing In, Zn and Sn; an oxide containing In and Zn; an oxide containing In and Sn; and an oxide containing In.
6. A field effect transistor provided with a source electrode, a drain electrode, a gate insulator, a gate electrode, and a transparent channel layer, wherein
the channel layer comprises an amorphous oxide of a compound having
(a) a composition when in crystalline state represented by In 2−x M3 x O 3 (Zn 1−y M2 y O) m , wherein M2 is Mg or Ca; M3 is B, Al, Ga or Y; 0≦x ≦2; 0≦y ≦1; and m is zero or a natural number less than 6, or a mixture of said compounds;
(b) an electric carrier concentration of 10 12 /cm 3 or more and less than 10 18 /cm 3 , wherein an electron mobility of the channel layer tends to increase with increase of the electron carrier concentration; and
(c) controlled oxygen defect density resulting from subjecting the amorphous oxide to treatment in an atmosphere containing oxygen at a predetermined pressure upon or after film formation; and
has a lamination structure comprised of a first layer in which at least one of the source electrode, the drain electrode and the gate electrode is transparent to visible light, and a second layer composed of a metal, or
has a lamination structure comprised of a first layer in which a wiring connected at least one of the source electrode, the drain electrode and the gate electrode is transparent to visible light, and a second layer composed of a metal, wherein current between the drain electrode and the source electrode when no gate voltage is applied is less than 10 microamperes.
7. A field effect transistor provided with a source electrode, a drain electrode, a gate insulator, a gate electrode, and a transparent channel layer, wherein
the channel layer comprises an amorphous oxide of a compound having
(a) a composition when in crystalline state represented by In 2−x M3 x O 3 (Zn 1−y M2 y O) m , wherein M2 is Mg or Ca; M3 is B, Al, Ga or Y; 0≦x ≦2; 0≦y ≦1; and m is zero or a natural number less than 6, or a mixture of said compounds;
(b) an electric carrier concentration of 10 12 /cm 3 or more and less than 10 18 /cm 3 , wherein an electron mobility of the channel layer tends to increase with increase of the electron carrier concentration, and;
(c) controlled oxygen defect density resulting from subjecting the amorphous oxide to treatment in an atmosphere containing oxygen at a predetermined pressure upon or after film formation; and
the gate insulator is comprised of a first layer being in contact with the amorphous oxide and a second layer different from the first layer and is laminated on the first layer, wherein current between the drain electrode and the source electrode when no gate voltage is applied is less than 10 microamperes.
8. The field effect transistor according to claim 7 , wherein the first layer is an insulating layer comprising HfO 2 , Y 2 O 3 , or a mixed crystal compound containing HfO 2 or Y 2 O 3 .
9. The field effect transistor according to claim 7 , wherein the amorphous oxide is an oxide containing at least one of In, Zn, and Sn, or an oxide containing In, Zn, and Ga.
10. The field effect transistor according to claim 7 , wherein the first layer is an interface improvement layer for improving an interfacial property with the channel layer, and the second layer is a current leakage prevention layer for preventing leakage of electric current.
11. The field-effect transistor according to claim 7 , wherein the amorphous oxide is any one selected from the group consisting of an oxide containing In, Zn and Sn; an oxide containing In and Zn; an oxide containing In and Sn; and an oxide containing In.
12. A field effect transistor provided with a source electrode, a drain electrode, a gate insulator, a gate electrode, and a transparent channel layer, wherein
the channel layer comprises an amorphous oxide of a compound having
(a) a composition when in crystalline state represented by In 2−x M3 x O 3 (Zn 1−y M2 y O) m , wherein M2 is Mg or Ca; M3 is B, Al, Ga or Y; 0≦x ≦2; 0≦y ≦1; and m is zero or a natural number less than 6, or a mixture of said compounds;
(b) an electric carrier concentration of 10 12 /cm 3 or more and less than 10 18 /cm 3 , wherein an electron mobility of the channel layer tends to increase with increase of the electron carrier concentration; and
(c) controlled oxygen defect density resulting from subjecting the amorphous oxide to treatment in an atmosphere containing oxygen at a predetermined pressure upon or after film formation; and
a passivation layer is provided between the channel layer and the gate insulator, wherein current between the drain electrode and the source electrode when no gate voltage is applied is less than 10 microamperes.
13. The field effect transistor according to claim 12 , wherein the amorphous oxide is an oxide containing at least one of In, Zn, and Sn, or an oxide containing In, Zn, and Ga.
14. The field effect transistor according to claim 12 , wherein the passivation layer is a current leakage prevention layer for preventing leakage of electric current.
15. A field effect transistor provided with a source electrode, a drain electrode, a gate insulator, a gate electrode, and a transparent channel layer on a substrate, wherein
the channel layer comprises an amorphous oxide of a compound having (a) a composition when in crystalline state represented by In 2−x M3 x O 3 (Zn 1−y M2 y O) m , wherein M2 is Mg or Ca; M3 is B, Al, Ga or Y; 0≦x ≦2; 0≦y ≦1; and m is zero or a natural number less than 6, or a mixture of said compounds;
(b) an electric carrier concentration of 10 12 /cm 3 or more and less than 10 18 /cm 3 , wherein an electron mobility of the channel layer tends to increase with increase of the electron carrier concentration; and
(c) controlled oxygen defect density resulting from subjecting the amorphous oxide to treatment in an atmosphere containing oxygen at a predetermined pressure upon or after film formation; and
a surface-coating layer being provided between the channel layer and the substrate, wherein current between the drain electrode and the source electrode when no gate voltage is applied is less than 10 microamperes.
16. The field effect transistor according to claim 15 , wherein the amorphous oxide is an oxide containing at least one of In, Zn, and Sn, or an oxide containing In, Zn, and Ga.
17. The field effect transistor according to claim 15 , wherein the surface-coating layer is an adhesion-improvement layer for improving the adhesiveness between the substrate and the channel layer.