IP Library Granted Patent US 7,492,659
Granted Patent B2
US 7,492,659 · App. 11/270,586 · Granted Feb 17, 2009

Integrated circuit device and electronic instrument

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Quick Facts
Patent No.
US 7,492,659
App. No.
11/270,586
Granted
Feb 17, 2009
Kind
B2
Abstract

An integrated circuit device having a display memory, wherein a plurality of first power supply interconnects for supplying a first power supply voltage to a plurality of memory cells are provided in a metal interconnect layer in which a plurality of bitlines are formed; wherein a second power supply interconnect for supplying a second power supply voltage to the memory cells is provided in a metal interconnect layer in which a plurality of wordlines are formed, the second power supply voltage being higher than the first power supply voltage; wherein a plurality of bitline protection interconnects are formed in a layer above the bitlines, each of the bitline protection interconnects at least partially covering one of the bitlines in a plan view; and wherein a third power supply interconnect for supplying a third power supply voltage to circuits of the integrated circuit device other than the display memory is provided in a layer above the bitline protection interconnects, the third power supply voltage being higher than the second power supply voltage.

Claims (38)

1. An integrated circuit device having a display memory which stores at least part of data displayed in a display panel which has a plurality of scan lines and a plurality of data lines,

the display memory including a plurality of wordlines, a plurality of bitlines, and a plurality of memory cells,

a plurality of first power supply interconnects for supplying a first power supply voltage to the memory cells being provided in a metal interconnect layer in which the bitlines are formed,

a second power supply interconnect for supplying a second power supply voltage to the memory cells being provided in a metal interconnect layer in which the wordlines are formed, the second power supply voltage being higher than the first power supply voltage,

the bitlines being formed in a layer above the wordlines,

a plurality of bitline protection interconnects being formed in a layer above the bitlines, each of the bitline protection interconnects at least partially covering one of the bitlines in a plan view, and

a third power supply interconnect for supplying a third power supply voltage to circuits of the integrated circuit device other than the display memory being provided in a layer above the bitline protection interconnects, the third power supply voltage being higher than the second power supply voltage.

2. The integrated circuit device as defined in claim 1 ,

each of the memory cells having a short side and a long side,

the bitlines being formed in each of the memory cells along a first direction in which the long side of the memory cell extends, and

the wordlines being formed along a second direction in which the short side of the memory cell extends.

3. The integrated circuit device as defined in claim 2 ,

a protection interconnect non-formation region in which the bitline protection interconnects are not formed being provided in a layer above a region in which the first power supply interconnects are formed.

4. The integrated circuit device as defined in claim 3 ,

the protection interconnect non-formation region extending along the first direction.

5. The integrated circuit device as defined in claim 2 ,

the first power supply interconnects extending along the first direction, and

in each of the memory cells, a bitline pair formed of two of the bitlines being disposed between two of the first power supply interconnects.

6. The integrated circuit device as defined in claim 5 ,

the bitline protection interconnects extending along the first direction, and

in each of the memory cells, end sections of one of the bitline protection interconnects in the second direction at least partially covering the two of the first power supply interconnects in a plan view.

7. The integrated circuit device as defined in claim 2 ,

the bitline protection interconnects extending along the first direction.

8. The integrated circuit device as defined in claim 3 ,

the bitline protection interconnects extending along the second direction.

9. The integrated circuit device as defined in claim 8 ,

the protection interconnect non-formation region extending along the second direction.

10. The integrated circuit device as defined in claim 1 ,

the first power supply voltage being supplied to the bitline protection interconnects.

11. The integrated circuit device as defined in claim 1 ,

the bitline protection interconnects being electrically connected to the first power supply interconnect.

12. An electronic instrument, comprising:

the integrated circuit device as defined in claim 1 , and

a display panel.

13. The electronic instrument as defined in claim 12 ,

the integrated circuit device being mounted on a substrate which forms the display panel.

14. The electronic instrument as defined in claim 13 ,

the integrated circuit device being mounted on the substrate so that the wordlines of the integrated circuit device are disposed parallel to a direction in which the data lines of the display panel extend.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2018
From: SEIKO EPSON CORPORATION
To: 138 EAST LCD ADVANCEMENTS LIMITED
Reel/Frame 046153/0397 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2005
From: KODAIRA, SATORU; ITOMI, NOBORU; KAWAGUCHI, SHUJI; KUMAGAI, TAKASHI; ISHIYAMA, HISANOBU; MAEKAWA, KAZUHIRO
To: SEIKO EPSON CORPORATION
Reel/Frame 017210/0952 →