Semiconductor light-emitting device, lighting module and lighting apparatus
View Patent ↗A semiconductor light-emitting device includes: a support; a semiconductor light-emitting element bonded to the support and comprising a first electrode, a second electrode, and a semiconductor layer including at least an active layer, at least one of the first and second electrodes overlying the semiconductor layer; and a wiring metal formed to extend from above a portion of an upper surface of the support not underlying the semiconductor light-emitting element to one said electrode overlying the semiconductor layer. The electrode is fed with power through the wiring metal.
1. A semiconductor light-emitting device, comprising:
a support consisting of a metal material;
a semiconductor light-emitting element bonded to the support and comprising a first electrode, a second electrode, and a semiconductor layer including at least an active layer and formed from a III-V nitride semiconductor layer, the first electrode being located on a lower surface of the semiconductor light-emitting element, and being electrically connected to the support, and the second electrode being located on an upper surface of the semiconductor light-emitting element opposite to the lower surface; and
a patterned metal film formed to continuously extend over the second electrode overlying the semiconductor layer, a portion of a side surface of the semiconductor layer and a portion of an upper surface of the support not underlying the semiconductor light-emitting element,
wherein the second electrode is fed with power through the metal film,
a portion of the metal film formed on the support forms an electrode pad, the electrode pad is electrically connected to the second electrode and the portion of the metal film is electrically insulated from the support by an insulating film,
the insulating film is formed on the support and on the side surface of the semiconductor layer, and the metal film is formed on the insulating film, and
the semiconductor layer includes an n-type gallium nitride compound semiconductor layer, which is connected to the second electrode, in the upper side thereof, and a p-type gallium nitride compound semiconductor layer, which is connected to the first electrode, in the lower side thereof.
2. The semiconductor light-emitting device of claim 1 , wherein the semiconductor light-emitting element is bonded to the support via a fusion material.
3. The semiconductor light-emitting device of claim 1 , wherein a plurality of said semiconductor light-emitting elements are bonded to the support.
4. The semiconductor light-emitting device of claim 1 , wherein the semiconductor layer has a thickness of 30 μm or less.
5. The semiconductor light-emitting device of claim 1 , wherein the insulating film has a thickness of 100 nm or more.
6. The semiconductor light-emitting device of claim 1 , wherein the insulating film is a film made of any one material selected from the group consisting of SiO 2 , SiN, TiO 2 , Nd 2 O 5 , Ta 2 O 5 , and ZrO 2 , or a multilayer film made of materials selected from the group.
7. The semiconductor light-emitting device of claim 2 , wherein the fusion material is made of PbSn, AuSn, AgSn or InSn.
8. The semiconductor light-emitting device of claim 1 , wherein the support is one of Cu, Al, Au and CuW.
9. The semiconductor light-emitting device of claim 1 , wherein the angle between a portion of the upper surface of the support not underlying the semiconductor light-emitting element and a side surface of the semiconductor light-emitting element is more than 90 degrees and less than 180 degrees.
10. The semiconductor light-emitting device of claim 1 , wherein said second electrodes formed on the upper surface of the semiconductor layer is formed on the upper surface of the semiconductor layer at the center thereof.
11. The semiconductor light-emitting device of claim 1 , wherein a resin material containing a phosphor excited by light emitted from the semiconductor light-emitting element is formed on a surface of the semiconductor light-emitting element.
12. A lighting apparatus comprising a lighting module having a semiconductor light-emitting device, the semiconductor light-emitting device comprising:
a support consisting of a metal material;
a semiconductor light-emitting element bonded to the support and comprising a first electrode, a second electrode, and a semiconductor layer including at least an active layer and formed from a III-V nitride semiconductor layer, the first electrode being located on a lower surface of the semiconductor light-emitting element, and being electrically connected to the support, and the second electrode being located on an upper surface of the semiconductor light-emitting element opposite to the lower surface; and
a patterned metal film formed to continuously extend over the second electrode overlying the semiconductor layer, a portion of a side surface of the semiconductor layer and a portion of an upper surface of the support not underlying the semiconductor light-emitting element,
wherein the second electrode is fed with power through the metal film, and
a portion of the metal film formed on the support forms an electrode pad, the electrode pad is electrically connected to the second electrode and the portion of the metal film is electrically insulated from the support by an insulating film,
the insulating film is formed on the support and on the side surface of the semiconductor layer, and the metal film is formed on the insulating film, and
the semiconductor layer includes an n-type gallium nitride compound semiconductor layer, which is connected to the second electrode, in the upper side thereof, and a p-type gallium nitride compound semiconductor layer, which is connected to the first electrode in the lower side thereof.
13. The semiconductor light-emitting device of claim 1 , further comprising an insulating film, wherein:
a lower surface of the insulating film continuously extends over and connects to the portion of the side surface of the semiconductor layer and the portion of the upper surface of the support not underlying the semiconductor light-emitting element, and
a lower surface of the patterned metal film continuously extends over and connects to the upper surface of the insulating film.
14. The lighting apparatus of claim 12 , further comprising an insulating film, wherein:
a lower surface of the insulating film continuously extends over and connects to the portion of the side surface of the semiconductor layer and the portion of the upper surface of the support not underlying the semiconductor light-emitting element, and
a lower surface of the patterned metal film continuously extends over and connects to the upper surface of the insulating film.
15. The semiconductor light-emitting device of claim 1 , wherein a wire-bonding area is disposed over the electrode pad.
16. The semiconductor light-emitting device of claim 1 , wherein the electrode pad is disposed on the portion of the upper surface of the support not underlying the semiconductor light-emitting element.
17. The lighting apparatus of claim 12 , wherein a wire-bonding area is disposed over the electrode pad.
18. The lighting apparatus of claim 12 , wherein the electrode pad is disposed on the portion of the upper surface of the support not underlying the semiconductor light-emitting element.
19. The semiconductor light-emitting device of claim 1 , wherein the semiconductor light-emitting element bonded to the support without interposing the insulating film.
20. The lighting apparatus of claim 12 , wherein the semiconductor light-emitting element bonded to the support without interposing the insulating film.
21. The semiconductor light-emitting device of claim 1 , wherein the insulating film is in contact with the support.
22. The lighting apparatus of claim 12 , wherein the insulating film is in contact with the support.