Semiconductor device and manufacturing method thereof

1. A semiconductor device comprising:

a semiconductor element;

a passive component;

a printed board connecting said semiconductor element and said passive component; and

a first connection portion between said semiconductor element and said printed board and a second connection portion between said passive component,

wherein the first and second connection portions each include:

a first layer of an intermetallic compound with a melting point of 260° C. or higher;

a second layer of an intermetallic compound with a melting point of 260° C. or higher; and

a third layer of a metal with a melting point of 260° C. or higher between said first layer and said second layer.

2. The semiconductor device according to claim 1 ,

wherein said first and second layers of intermetallic compound with a melting point of 260° C. or higher is formed through a reaction caused at a time of connecting at least one of Sn, In, Sn—Ag base, Sn—Cu base, Sn—Ag—Cu base, Sn—Zn base, Sn—Zn—Bi base, Sn—In base, In—Ag base, In—Cu base, Bi—Sn base, and Bi—In base Pb-free solders each having a melting point of 260° C. or lower and at least one of Cu, Ag, Ni, and Au metals.

3. The semiconductor device according to claim 1 ,

wherein said metal with a melting point of 260° C. or higher includes at least one of Cu, Ag, Ni, and Au that reacts with Sn, In, Sn—Ag base, Sn—Cu base, Sn—Ag—Cu base, Sn—Zn base, Sn—Zn—Bi base, Sn—In base, In—Ag base, In—Cu base, Bi—Sn base, and Bi—In base Pb-free solders each having a melting point of 260° C. or lower to form an intermetallic compound.

4. The semiconductor device according to claim 1 ,

wherein said metal with a melting point of 260° C. or higher is such that Al, Zn, Mg, Cu/an Invar alloy/a Cu composite material, a Cu/Cu 2 O composite material, a Cu—Mo alloy, Ti, Mo, and W is metallized with at least one of Cu, Ag, Ni, and Au, which reacts with Sn, In, Sn—Ag base, Sn—Cu base, Sn—Ag—Cu base, Sn—Zn base, Sn—Zn—Bi base, Sn—In base, In—Ag base, In—Cu base, Bi—Sn base, and Bi—In base Pb-free solders each having a melting point of 260° C. or lower to form an intermetallic compound.

5. A semiconductor device comprising:

a semiconductor element;

a printed board connecting said semiconductor element, and

a connection portion between said semiconductor element and said printed board,

wherein said connection portion includes,

a first layer of an intermetallic compound with a melting point of 260° C. or higher;

a second layer of an intermetallic compound with a melting point of 260° C. or higher;

a third layer of a metal with a melting point of 260° C. or higher between said first layer and said second layer.

6. A semiconductor device according to claim 5 ,

wherein said metal is at least one of Cu, Ag, Ni and Au.

7. A semiconductor device according to claim 5 ,

wherein said first and second layers of an intermetallic compound is formed through a reaction caused at a time of connecting at least one of Sn, In, Sn—Ag base, Sn—Cu base, Sn—Ag—Cu base; Sn—Zn—Bi base, Sn—In base, In—Ag base, In—Cu base, Bi—Sn base, and Bi—In base Pb-free solders each having a melting point of 260° C. or lower and at least one of Cu, Ag, Ni, and Au metal.

8. A semiconductor device according to claim 1 ,

wherein thicknesses of said first and second layers of an intermetallic compound are 1 μm to 20 μm.

9. A semiconductor device according to claim 1 ,

wherein both said intermetallic compound and said metal are Pb-free material.

10. A semiconductor device according to claim 5 ,

wherein thicknesses of said first and second layers of an intermetallic compound are 1 μm to 20 μm.

11. A semiconductor device according to claim 5 ,

wherein both said intermetallic compound and said metal are Pb-free material.